H10W 99/00
Subject matter not provided for in other groups of this subclass
H10W99/00 (Subject matter not provided for in other groups of this subclass) appears on 6,695 US grants and 8,315 published applications in this corpus.
Search patents in H10W- Granted patents
- 6,695
- Published applications
- 8,315
- Assignees
- 1,355
- Inventors
- 12,014
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 13 | 0 |
| 1977 | 10 | 0 |
| 1978 | 9 | 0 |
| 1979 | 7 | 0 |
| 1980 | 6 | 0 |
| 1981 | 16 | 0 |
| 1982 | 3 | 0 |
| 1983 | 8 | 0 |
| 1984 | 13 | 0 |
| 1985 | 13 | 0 |
| 1986 | 19 | 0 |
| 1987 | 17 | 0 |
| 1988 | 21 | 0 |
| 1989 | 21 | 0 |
| 1990 | 27 | 0 |
| 1991 | 37 | 0 |
| 1992 | 49 | 0 |
| 1993 | 40 | 0 |
| 1994 | 34 | 0 |
| 1995 | 29 | 0 |
| 1996 | 40 | 0 |
| 1997 | 37 | 0 |
| 1998 | 52 | 0 |
| 1999 | 66 | 0 |
| 2000 | 49 | 0 |
| 2001 | 75 | 38 |
| 2002 | 79 | 99 |
| 2003 | 89 | 91 |
| 2004 | 88 | 112 |
| 2005 | 75 | 128 |
| 2006 | 79 | 123 |
| 2007 | 90 | 165 |
| 2008 | 79 | 178 |
| 2009 | 102 | 178 |
| 2010 | 137 | 191 |
| 2011 | 145 | 246 |
| 2012 | 169 | 235 |
| 2013 | 238 | 256 |
| 2014 | 243 | 335 |
| 2015 | 285 | 384 |
| 2016 | 338 | 348 |
| 2017 | 333 | 329 |
| 2018 | 301 | 391 |
| 2019 | 361 | 415 |
| 2020 | 387 | 529 |
| 2021 | 372 | 476 |
| 2022 | 383 | 565 |
| 2023 | 402 | 590 |
| 2024 | 405 | 842 |
| 2025 | 441 | 668 |
| 2026 | 363 | 403 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device and method of fabricating the same6 Oct 2026US 12,757,777 B2Samsung Electronics Co., Ltd.
- Rapid thermal processing for direct bonding6 Oct 2026US 12,757,806 B2Adeia Semiconductor Bonding Technologies Inc.
- Laser processing apparatus including a hole in a workpiece having a resin layer, laser processing method, and electronic device manufacturing method having the same29 Sep 2026US 12,746,618 B2Gigaphoton Inc.
- Edge structure of semiconductor wafer and manufacturing method thereof29 Sep 2026US 12,751,231 B2United Microelectronics Corp.
- Selective alteration of interconnect pads for direct bonding29 Sep 2026US 12,751,313 B2Adeia Semiconductor Bonding Technologies Inc.
- Interconnect structure and method of forming same8 Oct 2026US 2026/0306859 A1Taiwan Semiconductor Manufacturing Company.Ltd
- 2.5D/3D electronic packaging structure and method for manufacturing same8 Oct 2026US 2026/0314445 A1SJ Semiconductor(Jiangyin) Corporation
- Semiconductor structure and manufacturing method thereof8 Oct 2026US 2026/0314466 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Treatment process for wafer bonding processes8 Oct 2026US 2026/0314509 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Metal smart card and method for manufacturing a smart card of this kind1 Oct 2026US 2026/0300672 A1Idemia France
Most cited
By later US patents
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Package semiconductor chip567US 4,862,245 AInternational Business Machines Corporation · 1989