Metal smart card and method for manufacturing a smart card of this kind

A method for manufacturing a smart card including a card body having a metal layer, the metal layer having a first side, a second side opposite from the first side, and a thickness defined between the first side and the second side, the metal layer exhibiting a first recess formed from the first side and extending over a part of the thickness of the metal layer and a second recess formed from the second side and extending over a part of the thickness of the metal layer, the first recess opening into the second recess, an electronic module including:

• a support having an internal side and an external side, which is opposite from the internal side, an array of external contact pads disposed on the external side of the support and configured to allow contact-based communication with an external terminal, a microcircuit carried by the support and electrically connected to the external contact, and a first set of bonding pads disposed on the internal side of the support and electrically connected to the microcircuit, the electronic module being received in the first recess with the array of external contact pads flush with the first side of the metal layer, an electrical connection block including:
• a substrate exhibiting an internal side and an external side, which is opposite from the internal side, and a second set of bonding pads disposed on the internal side of the substrate, the electrical connection block being received in the second recess with the second set of bonding pads electrically contact-connected with the first set of bonding pads of the electronic module, a first radio-frequency antenna disposed outside the first recess and electrically connected to the second set of bonding pads of the electrical connection block, and the first set of bonding pads of the electronic module and the second set of bonding pads of the electrical connection block electrically interconnecting the microcircuit and the first radio-frequency antenna, comprising:
• introducing the electrical connection block into the second recess from the second side of the metal layer;
• and
• introducing the electronic module into the first recess from the first side of the metal layer,
• wherein the electrical interconnection between the microcircuit and the first radio-frequency antenna is produced by introducing the electronic module and/or introducing the electrical connection block into their respective recesses until the first set of bonding pads and the second set of bonding pads come into contact.