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US 2026/0314509 A1Published application
Treatment process for wafer bonding processes
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMing-Tsu Chung, Yung-Chi Lin, Yan-Zuo Tsai, Yang-Chih Hsueh
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Abstract
A method includes performing a plasma treatment on a first wafer, performing a treatment process on the first wafer, wherein the treatment process results in the first wafer to be more hydrophobic than before the treatment process, pre-bonding the first wafer to a second wafer through wafer-to-wafer bonding, and performing an annealing process to bond the first wafer to the second wafer.
Claims20
A method comprising:
- performing a first treatment process on a first surface of a first wafer, wherein the first treatment process is performed using a first chemical comprising carbon;
- performing a second treatment process on a second surface of a second wafer, wherein the second treatment process is performed using a second chemical comprising carbon;
- pre-bonding the first wafer to the second wafer, wherein the first surface of the first wafer is in contact with the second surface of the second wafer;
- and
- performing an annealing process to bond the first wafer to the second wafer.
2 more elements
A method comprising:
- forming a first package component comprising a first planar surface;
- performing a first treatment process on the first planar surface, wherein the first treatment process is performed using a first chemical comprising silicon and carbon;
- performing a pre-bonding process to put the first planar surface in contact with a second planar surface of a second package component;
- and
- performing an annealing process to bond the first package component to the second package component.
2 more elements
A method comprising:
- exposing a surface of a first package component to moisture;
- after the surface of the first package component is exposed to the moisture, performing a treatment process on the surface;
- performing a pre-bonding process to pre-bond the first package component to a second package component;
- and
- performing an annealing process on the first package component and the second package component.
2 more elements
Dependencies are inferred from the claim text.