Laser processing apparatus including a hole in a workpiece having a resin layer, laser processing method, and electronic device manufacturing method having the same

A laser processing method for forming a hole in a workpiece having a resin layer disposed on a processing surface by irradiating the workpiece with a laser beam discharge-excited between a pair of discharge electrodes and then output, the laser processing method comprising:

• a workpiece setting step of setting the workpiece on which the resin layer is disposed on a table of a moving stage;
• a transfer positioning step of performing relative positioning between a transfer position and the workpiece such that the transfer position and a surface of the resin layer coincide;
• a laser outputting step of outputting the laser beam, having a first divergence angle in a discharge direction between a pair of discharge electrodes larger than a second divergence angle in a direction perpendicular to the discharge direction and a traveling direction of the laser beam, to the workpiece on which the resin layer is disposed;
• an introducing optical step of guiding the laser beam to a transfer mask;
• a transfer pattern forming step of forming a transfer pattern;
• a transfer imaging step of imaging the transfer pattern on the resin layer;
• and
• a divergence angle adjusting step of adjusting a difference between the first divergence angle and the second divergence angle to be reduced.

An electronic device manufacturing method comprising:

• a first coupling step of coupling and electrically connecting an interposer and an integrated circuit chip to each other;
• and
• a second coupling step of coupling and electrically connecting the interposer and a circuit board to each other,
• the interposer including an insulating substrate in which a plurality of through-holes are formed and conductors provided in the through-holes,
• the through-holes being formed by a laser processing method of forming a hole at each irradiation position of a plurality of laser beams with which the insulating substrate having a processing surface with a resin layer disposed thereon is irradiated, and
• the laser processing method including
• generating the laser beam having a first divergence angle in a discharge direction between a pair of discharge electrodes larger than a second divergence angle in a direction perpendicular to the discharge direction and a traveling direction of the laser beam, reducing a difference between the first divergence angle and the second divergence angle of the laser beam, and then imaging the laser beam on the resin layer to form the through-holes in the insulating substrate.