H10W 29/00
Generic parts of integrated devices, not otherwise provided for
H10W29/00 (Generic parts of integrated devices, not otherwise provided for) appears on 46 US grants and 59 published applications in this corpus.
Search patents in H10W- Granted patents
- 46
- Published applications
- 59
- Assignees
- 31
- Inventors
- 119
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2009 | 1 | 3 |
| 2010 | 0 | 1 |
| 2011 | 1 | 1 |
| 2012 | 1 | 2 |
| 2013 | 3 | 2 |
| 2014 | 4 | 7 |
| 2015 | 4 | 2 |
| 2016 | 4 | 4 |
| 2017 | 1 | 2 |
| 2018 | 2 | 4 |
| 2019 | 8 | 4 |
| 2020 | 2 | 0 |
| 2021 | 2 | 4 |
| 2022 | 1 | 2 |
| 2023 | 4 | 5 |
| 2024 | 3 | 5 |
| 2025 | 1 | 3 |
| 2026 | 4 | 8 |
By publication year. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Implantable medical device selective encapsulation1 Sep 2026US 12,725,751 B2Cardiac Pacemakers, Inc.
- Combined charge balance and edge termination surface passivation for a semiconductor device and methods of fabricating the same1 Sep 2026US 12,727,209 B2Ideal Semiconductor Devices, Inc.
- Semiconductor device and method of manufacturing a semiconductor device18 Aug 2026US 12,713,925 B2Infineon Technologies Austria AG
- IC having electrically isolated warpage prevention structures6 Jan 2026US 12,519,068 B2Texas Instruments Incorporated
- Semiconductor metal layer structure over cell region21 Oct 2025US 12,450,417 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor substrate, semiconductor epitaxial wafer, and method of manufacturing semiconductor substrate24 Sep 2026US 2026/0293560 A1Mitsubishi Electric Corporation
- Semiconductor module10 Sep 2026US 2026/0271776 A1Shindengen Electric Manufacturing Co., Ltd.
- Semiconductor device and method of manufacturing the same3 Sep 2026US 2026/0259351 A1Samsung Electronics Co., Ltd.
- Insulation signal transmission element and semiconductor device6 Aug 2026US 2026/0231759 A1Rohm Co., Ltd.
- Semiconductor Module Arrangement Comprising at Least One Semiconductor Element6 Aug 2026US 2026/0231766 A1Siemens Aktiengesellschaft
Most cited
By later US patents
- System on a chip with on-chip RF shield27US 7,948,064 B2Infineon Technologies AG · 2011
- Stressed substrates for transient electronic systems24US 9,154,138 B2Palo Alto Research Center Incorporated · 2015
- Thermally tempered glass substrate using CTE mismatched layers and paste mixtures for transient electronic systems23US 9,356,603 B2Palo Alto Research Center Incorporated · 2016
- Alignment for backside illumination sensor21US 7,588,993 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2009
- Semiconductor memory devices including separate upper and lower bit line spacers7US 10,373,960 B2Samsung Electronics Co., Ltd. · 2019