Semiconductor module
AssigneeShindengen Electric Manufacturing Co., Ltd.
InventorsHayato INABA, Takashi IKEDA, Ryoji KUWANO
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AssigneeShindengen Electric Manufacturing Co., Ltd.
InventorsHayato INABA, Takashi IKEDA, Ryoji KUWANO
Estimating the term…
[Problem] The purpose is to provide a semiconductor module in which a case is reinforced and warpage can be suppressed by providing a plurality of ribs extending from ends of a terminal block. [Solution] In a semiconductor module 1 according to the present invention, a case 20 is attached in an annular manner around an edge 11 of a substrate 10. The semiconductor module 1 is characterized in that the case 20 has a terminal block 30, inner ribs 50, outer ribs 60, and intermediate ribs 70, and a plurality of inner ribs 50, a plurality of outer ribs 60, and a plurality of intermediate ribs 70 are provided so as to extend from the terminal block 30.
A semiconductor module having a case and a substrate, the case being attached in an annular manner around an edge of the substrate,
Dependencies are inferred from the claim text.