Thermally tempered glass substrate using CTE mismatched layers and paste mixtures for transient electronic systems

A method for manufacturing a transient electronic device comprising:

• forming a thermally tempered glass substrate including:
• disposing a first glass structure and a plurality of second glass structures in an intermixed arrangement, said first glass structure including a first glass material having a first coefficient of thermal expansion (CTE) value and a first thermal transition point temperature, and said plurality of second glass structures including a second glass material having a second CTE value and a second thermal transition point temperature, the second CTE value being different from the first CTE value,
• heating the intermixed arrangement of first and second glass structures to a temperature higher than the first and second glass transition points such that the first and second glass materials melt and fuse together;
• and
• cooling the melted/fused first and second glass structures such that the difference between the first and second CTE values generates and stores potential energy in the form of residual, self-equilibrating internal stresses.

A transient electronic device comprising:

• a thermally tempered glass substrate including:
• a first glass structure including a first glass material having a first coefficient of thermal expansion (CTE) value;
• a plurality of second glass structures respectively including one or more second glass materials respectively having a second CTE value, the second CTE value being different from the first CTE value,
• wherein the plurality of second glass structures are integrally attached to the first glass structure such that the difference between the first CTE value and the second CTE value generates residual tensile and compressive stresses, and such that the residual tensile and compressive stresses remain stable until said thermally tempered glass substrate is subjected to an externally applied initial fracture force sufficient to generate secondary fractures that propagate throughout said thermally tempered glass substrate, whereby said thermally tempered glass substrate is powderized, and
• a trigger mechanism attached to the thermally tempered glass substrate and including means for generating an initial fracture in said thermally tempered glass substrate,
• wherein said residual tensile and compressive stresses are sufficient to generate secondary fractures in response to said initial fracture that propagate throughout said thermally tempered glass substrate, whereby said thermally tempered glass substrate is powderized.