H10W 74/00
Encapsulations
Official title: Encapsulations, e.g. protective coatings
H10W74/00 (Encapsulations) appears on 57,134 US grants and 67,131 published applications in this corpus.
Search patents in H10W- Granted patents
- 57,134
- Published applications
- 67,131
- Assignees
- 4,884
- Inventors
- 56,942
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 64 | 0 |
| 1977 | 66 | 0 |
| 1978 | 46 | 0 |
| 1979 | 36 | 0 |
| 1980 | 35 | 0 |
| 1981 | 36 | 0 |
| 1982 | 37 | 0 |
| 1983 | 22 | 0 |
| 1984 | 34 | 0 |
| 1985 | 52 | 0 |
| 1986 | 61 | 0 |
| 1987 | 74 | 0 |
| 1988 | 68 | 0 |
| 1989 | 98 | 0 |
| 1990 | 116 | 0 |
| 1991 | 163 | 0 |
| 1992 | 211 | 0 |
| 1993 | 203 | 0 |
| 1994 | 299 | 0 |
| 1995 | 291 | 0 |
| 1996 | 326 | 0 |
| 1997 | 374 | 0 |
| 1998 | 613 | 0 |
| 1999 | 741 | 0 |
| 2000 | 760 | 0 |
| 2001 | 1018 | 501 |
| 2002 | 1149 | 1460 |
| 2003 | 1257 | 1491 |
| 2004 | 1304 | 1759 |
| 2005 | 1222 | 2062 |
| 2006 | 1305 | 2009 |
| 2007 | 1289 | 2153 |
| 2008 | 1176 | 2368 |
| 2009 | 1294 | 2436 |
| 2010 | 1833 | 2417 |
| 2011 | 2026 | 2484 |
| 2012 | 2043 | 2500 |
| 2013 | 2236 | 2627 |
| 2014 | 2496 | 2907 |
| 2015 | 2651 | 3198 |
| 2016 | 2886 | 3002 |
| 2017 | 2974 | 2948 |
| 2018 | 2664 | 2792 |
| 2019 | 2782 | 3046 |
| 2020 | 2743 | 3470 |
| 2021 | 2529 | 3225 |
| 2022 | 2452 | 3292 |
| 2023 | 2522 | 3326 |
| 2024 | 2443 | 3691 |
| 2025 | 2337 | 3565 |
| 2026 | 1677 | 2402 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method of manufacturing a redistribution layer, redistribution layer, integrated circuit and methods for electrically testing and protecting the integrated circuit6 Oct 2026US 12,753,493 B2STMicroelectronics S,r.l.
- Nitride-based bidirectional switching device and method for manufacturing the same6 Oct 2026US 12,757,426 B2Innoscience (Suzhou) Semiconductor Co., Ltd.
- Image sensor package including a chip stack structure6 Oct 2026US 12,757,506 B2Samsung Electronics Co., Ltd.
- Semiconductor packages with wettable flanks and related methods6 Oct 2026US 12,757,696 B2Semiconductor Components Industries, LLC
- Package structure and manufacturing method thereof6 Oct 2026US 12,757,706 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Production method for boron nitride particles, production method for resin composition, and uses therefor8 Oct 2026US 2026/0307992 A1Resonac Corporation
- Current sensor and manufacturing method of current sensor8 Oct 2026US 2026/0309753 A1Asahi Kasei Microdevices Corporation
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0312273 A1Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor storage device8 Oct 2026US 2026/0313798 A1Kioxia Corporation
- Package structure and method for forming the same8 Oct 2026US 2026/0313918 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Analyte monitoring device and methods of use2,634US 6,175,752 B1TheraSense, Inc. · 2001
- Analyte monitoring device and methods of use2,053US 6,565,509 B1TheraSense, Inc. · 2003
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Non-protruding optoelectronic lens1,266US 6,525,386 B1Masimo Corporation · 2003
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015