H10W 74/40
Encapsulations: characterised by their materials
Official title: characterised by their materials
H10W74/40 (Encapsulations: characterised by their materials) appears on 5,307 US grants and 6,489 published applications in this corpus.
Search patents in H10W- Granted patents
- 5,307
- Published applications
- 6,489
- Assignees
- 1,300
- Inventors
- 11,553
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 38 | 0 |
| 1977 | 34 | 0 |
| 1978 | 21 | 0 |
| 1979 | 14 | 0 |
| 1980 | 11 | 0 |
| 1981 | 9 | 0 |
| 1982 | 17 | 0 |
| 1983 | 7 | 0 |
| 1984 | 9 | 0 |
| 1985 | 15 | 0 |
| 1986 | 19 | 0 |
| 1987 | 17 | 0 |
| 1988 | 21 | 0 |
| 1989 | 23 | 0 |
| 1990 | 29 | 0 |
| 1991 | 42 | 0 |
| 1992 | 55 | 0 |
| 1993 | 43 | 0 |
| 1994 | 51 | 0 |
| 1995 | 34 | 0 |
| 1996 | 40 | 0 |
| 1997 | 43 | 0 |
| 1998 | 60 | 0 |
| 1999 | 63 | 0 |
| 2000 | 58 | 0 |
| 2001 | 74 | 22 |
| 2002 | 79 | 106 |
| 2003 | 86 | 83 |
| 2004 | 63 | 100 |
| 2005 | 63 | 110 |
| 2006 | 58 | 122 |
| 2007 | 57 | 97 |
| 2008 | 44 | 128 |
| 2009 | 73 | 123 |
| 2010 | 80 | 155 |
| 2011 | 109 | 165 |
| 2012 | 113 | 208 |
| 2013 | 137 | 276 |
| 2014 | 225 | 297 |
| 2015 | 247 | 331 |
| 2016 | 288 | 368 |
| 2017 | 368 | 460 |
| 2018 | 340 | 351 |
| 2019 | 338 | 373 |
| 2020 | 317 | 394 |
| 2021 | 289 | 332 |
| 2022 | 234 | 320 |
| 2023 | 213 | 380 |
| 2024 | 207 | 431 |
| 2025 | 215 | 379 |
| 2026 | 217 | 378 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method of manufacturing a redistribution layer, redistribution layer, integrated circuit and methods for electrically testing and protecting the integrated circuit6 Oct 2026US 12,753,493 B2STMicroelectronics S,r.l.
- Patterned sheet MUF for complex packages and methods of producing6 Oct 2026US 12,757,781 B2Intel Corporation
- Semiconductor device6 Oct 2026US 12,757,782 B2Samsung Electronics Co., Ltd.
- Encapsulating semiconductor chips using masks6 Oct 2026US 12,757,793 B2Kioxia Corporation
- Semiconductor device and method of forming the same6 Oct 2026US 12,757,802 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Production method for boron nitride particles, production method for resin composition, and uses therefor8 Oct 2026US 2026/0307992 A1Resonac Corporation
- Semiconductor device having a layered source pad8 Oct 2026US 2026/0314377 A1Microchip Technology Incorporated
- Power module with selective heat spreader8 Oct 2026US 2026/0314407 A1Microchip Technology Incorporated
- Semiconductor structure8 Oct 2026US 2026/0314475 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Foundry Compatible, Ultra-low Resistance, Under-Bump-Metallization for Electroplated Bumps8 Oct 2026US 2026/0314479 A1
Most cited
By later US patents
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method for fabricating an integrated circuit module849US 5,353,498 AGeneral Electric Company · 1994
- Silicone polymer insulation film on semiconductor substrate and method for forming the film735US 6,383,955 B1ASM Japan K .K. · 2002
- Silicone polymer insulation film on semiconductor substrate and method for forming the film632US 6,352,945 B1ASM Japan K .K. · 2002
- Silicone polymer insulation film on semiconductor substrate and method for forming the film589US 6,455,445 B2ASM Japan K .K. · 2002