H10W 74/47
Comprising organic materials
Official title: comprising organic materials, e.g. plastics or resins
H10W74/47 (Comprising organic materials) appears on 3,781 US grants and 4,644 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,781
- Published applications
- 4,644
- Assignees
- 975
- Inventors
- 8,311
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 15 | 0 |
| 1977 | 17 | 0 |
| 1978 | 3 | 0 |
| 1979 | 5 | 0 |
| 1980 | 8 | 0 |
| 1981 | 5 | 0 |
| 1982 | 8 | 0 |
| 1983 | 3 | 0 |
| 1984 | 3 | 0 |
| 1985 | 11 | 0 |
| 1986 | 14 | 0 |
| 1987 | 11 | 0 |
| 1988 | 12 | 0 |
| 1989 | 17 | 0 |
| 1990 | 22 | 0 |
| 1991 | 27 | 0 |
| 1992 | 39 | 0 |
| 1993 | 33 | 0 |
| 1994 | 33 | 0 |
| 1995 | 28 | 0 |
| 1996 | 24 | 0 |
| 1997 | 32 | 0 |
| 1998 | 37 | 0 |
| 1999 | 53 | 0 |
| 2000 | 49 | 0 |
| 2001 | 68 | 20 |
| 2002 | 73 | 87 |
| 2003 | 75 | 71 |
| 2004 | 56 | 88 |
| 2005 | 50 | 97 |
| 2006 | 52 | 103 |
| 2007 | 50 | 82 |
| 2008 | 34 | 97 |
| 2009 | 54 | 99 |
| 2010 | 66 | 132 |
| 2011 | 89 | 142 |
| 2012 | 90 | 162 |
| 2013 | 104 | 214 |
| 2014 | 176 | 217 |
| 2015 | 184 | 264 |
| 2016 | 215 | 273 |
| 2017 | 274 | 312 |
| 2018 | 226 | 227 |
| 2019 | 236 | 251 |
| 2020 | 192 | 254 |
| 2021 | 209 | 217 |
| 2022 | 147 | 210 |
| 2023 | 144 | 239 |
| 2024 | 138 | 258 |
| 2025 | 137 | 253 |
| 2026 | 133 | 275 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Patterned sheet MUF for complex packages and methods of producing6 Oct 2026US 12,757,781 B2Intel Corporation
- Encapsulating semiconductor chips using masks6 Oct 2026US 12,757,793 B2Kioxia Corporation
- Semiconductor device and method of forming the same6 Oct 2026US 12,757,802 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Photosensitive resin composition, cured film, electronic component, antenna element, semiconductor package, and compound29 Sep 2026US 12,747,202 B2Toray Industries, Inc.
- Microelectronic device29 Sep 2026US 12,751,316 B2VisEra Technologies Company Limited
- Production method for boron nitride particles, production method for resin composition, and uses therefor8 Oct 2026US 2026/0307992 A1Resonac Corporation
- Power module with selective heat spreader8 Oct 2026US 2026/0314407 A1Microchip Technology Incorporated
- Semiconductor structure and method for producing same8 Oct 2026US 2026/0314482 A1Mitsui Chemicals, Inc.
- Semiconductor device and methods of manufacture8 Oct 2026US 2026/0314490 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package and method8 Oct 2026US 2026/0314498 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method for fabricating an integrated circuit module849US 5,353,498 AGeneral Electric Company · 1994
- Silicone polymer insulation film on semiconductor substrate and method for forming the film735US 6,383,955 B1ASM Japan K .K. · 2002
- Silicone polymer insulation film on semiconductor substrate and method for forming the film632US 6,352,945 B1ASM Japan K .K. · 2002
- Silicone polymer insulation film on semiconductor substrate and method for forming the film589US 6,455,445 B2ASM Japan K .K. · 2002