Semiconductor device and method of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsRui-Wen Song, Po-Yuan Teng, Hao-Yi Tsai, Chia-Hung Liu, Shih-Wei Chen
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Abstract
A semiconductor device includes a die, a redistribution layer (RDL) structure including a first polymer layer, a second polymer layer and a UBM layer. The die is encapsulated by an encapsulant. The RDL structure is disposed over the encapsulant. The second polymer layer is disposed on the first polymer layer, wherein a transmittance of the second polymer layer is smaller than a transmittance of the first polymer layer. The UBM layer is disposed over and electrically connected to the RDL structure, wherein the UBM layer is disposed in the first polymer layer and the second polymer layer.
Claims20
A semiconductor device, comprising:
- a die, encapsulated by an encapsulant;
- and
- a redistribution layer (RDL) structure over the encapsulant, comprising a first polymer layer;
- a second polymer layer on the first polymer layer, wherein a transmittance of the second polymer layer is smaller than a transmittance of the first polymer layer;
- and
- a UBM layer, disposed over and electrically connected to the RDL structure, wherein the UBM layer is disposed in the first polymer layer and the second polymer layer, and the first polymer layer is disposed between the die and the second polymer layer.
A semiconductor device, comprising:
- a die, encapsulated by an encapsulant;
- a RDL structure over the encapsulant, comprising a first polymer layer;
- a UBM layer, electrically connected to the RDL structure and disposed in the first polymer layer, wherein a top surface of the UBM layer is higher than a top surface of the first polymer layer;
- a second polymer layer over the RDL structure;
- and
- a laser mark in the second polymer layer, wherein a top surface of a portion of the second polymer layer is substantially coplanar with the top surface of the first polymer layer.
A semiconductor device, comprising:
- a RDL structure, comprising a first portion and a second portion;
- a first polymer layer, covering the first portion of the RDL structure;
- a second polymer layer, covering the second portion of the RDL structure, wherein a portion of the second polymer layer covers the first polymer layer, and a transmittance of the second polymer layer is smaller than a transmittance of the first polymer layer;
- a UBM layer in the first polymer layer, wherein a top surface of the UBM layer is higher than a top surface of the first polymer layer;
- and
- a die, bonded to the RDL structure.
Dependencies are inferred from the claim text.