H10W 74/476
Organic materials comprising silicon
Official title: {Organic materials comprising silicon}
H10W74/476 (Organic materials comprising silicon) appears on 602 US grants and 812 published applications in this corpus.
Search patents in H10W- Granted patents
- 602
- Published applications
- 812
- Assignees
- 229
- Inventors
- 1,513
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 7 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 0 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 3 | 0 |
| 1987 | 1 | 0 |
| 1988 | 4 | 0 |
| 1989 | 5 | 0 |
| 1990 | 4 | 0 |
| 1991 | 5 | 0 |
| 1992 | 3 | 0 |
| 1993 | 6 | 0 |
| 1994 | 6 | 0 |
| 1995 | 4 | 0 |
| 1996 | 4 | 0 |
| 1997 | 4 | 0 |
| 1998 | 5 | 0 |
| 1999 | 9 | 0 |
| 2000 | 6 | 0 |
| 2001 | 2 | 3 |
| 2002 | 7 | 6 |
| 2003 | 6 | 5 |
| 2004 | 6 | 12 |
| 2005 | 6 | 11 |
| 2006 | 5 | 11 |
| 2007 | 4 | 11 |
| 2008 | 5 | 19 |
| 2009 | 9 | 21 |
| 2010 | 11 | 26 |
| 2011 | 19 | 40 |
| 2012 | 23 | 32 |
| 2013 | 22 | 52 |
| 2014 | 46 | 57 |
| 2015 | 49 | 63 |
| 2016 | 42 | 58 |
| 2017 | 54 | 40 |
| 2018 | 31 | 31 |
| 2019 | 28 | 33 |
| 2020 | 26 | 32 |
| 2021 | 32 | 21 |
| 2022 | 15 | 27 |
| 2023 | 16 | 31 |
| 2024 | 14 | 31 |
| 2025 | 18 | 27 |
| 2026 | 18 | 112 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device, power conversion device and moving body22 Sep 2026US 12,745,640 B2Mitsubishi Electric Corporation
- Silicone gel composition, cured product thereof, and use therefor8 Sep 2026US 12,729,306 B2Dow Toray Co., Ltd.
- Chip package with contact clip8 Sep 2026US 12,730,135 B2Infineon Technologies AG
- Two-part molding of device packages with spacers8 Sep 2026US 12,733,537 B2NXP USA, Inc.
- Semiconductor module with meltable encapsulant zones11 Aug 2026US 12,708,028 B2Infineon Technologies AG
- Power module with selective heat spreader8 Oct 2026US 2026/0314407 A1Microchip Technology Incorporated
- Semiconductor device and methods of manufacture8 Oct 2026US 2026/0314490 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method for manufacturing semiconductor device and semiconductor device1 Oct 2026US 2026/0305501 A1Resonac Corporation
- Semiconductor module and method for manufacturing semiconductor module24 Sep 2026US 2026/0293755 A1Kabushiki Kaisha Toshiba
- Semiconductor device17 Sep 2026US 2026/0282980 A1Rohm Co., Ltd.
Most cited
By later US patents
- Silicone polymer insulation film on semiconductor substrate and method for forming the film735US 6,383,955 B1ASM Japan K .K. · 2002
- Silicone polymer insulation film on semiconductor substrate and method for forming the film632US 6,352,945 B1ASM Japan K .K. · 2002
- Silicone polymer insulation film on semiconductor substrate and method for forming the film589US 6,455,445 B2ASM Japan K .K. · 2002
- Method for forming film with low dielectric constant on semiconductor substrate512US 6,410,463 B1ASM Japan K .K. · 2002
- Process for the production of semiconductor devices455US 5,602,060 AFujitsu Limited · 1997