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US 2026/0293755 A1Published application
Semiconductor module and method for manufacturing semiconductor module
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsNobuaki MAKINO, Satoshi AKUTSU, Takuma SUZUKI
Life of this patent
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Abstract
A semiconductor module according to an embodiment includes a semiconductor element, an electrode, and a sealing member. The electrode is electrically connected to the semiconductor element. The sealing member covers at least a portion of the electrode. The sealing member includes a SiN layer and a silicone gel layer. The SiN layer includes a Si-N-Si bond. The silicone gel layer includes a silicone gel.
Claims12
A semiconductor module, comprising:
- a semiconductor element;
- an electrode electrically connected to the semiconductor element;
- and
- a sealing member covering at least a portion of the electrode,
- the sealing member including
- a SiN layer including a Si-N-Si bond, and
- a silicone gel layer including a silicone gel.
4 more elements
A method for manufacturing a semiconductor module, the method comprising:
- a first process of forming an electrode electrically connected to a semiconductor element;
- and
- a second process of forming a sealing member to cover at least a portion of the electrode,
- the sealing member including
- a SiN layer including a Si-N-Si bond, and
- a silicone gel layer including a silicone gel.
3 more elements
Dependencies are inferred from the claim text.