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US 12,733,537 B2Granted
Two-part molding of device packages with spacers
AssigneeNXP USA, Inc.
InventorsAnkur Shah, Michael B. Vincent
Life of this patent
Estimating the term…
Abstract
A device package is formed form a volume of molding material that encapsulates a component. Edges of the component are protected by encapsulated areas formed above the edges by a filler material prior to molding the component. The molding material also encapsulates the filler material and positioning of the filler material defines a location and dimensions of an aperture in the molding material that exposes a portion of a top surface of the component.
Claims15
A method of fabricating a device package, the method comprising:
- receiving a component;
- encapsulating two or more edges of the component by disposing a filler material over the two or more edges of the component such that the filler material forms encapsulated areas above a top surface of the component, the encapsulated areas having substantially flat surfaces;
- bringing a mold insert into contact with the substantially flat surfaces of the encapsulated areas;
- molding the component within a volume of molding material while the mold insert contacts the substantially flat surfaces of the encapsulated areas such that the component is encapsulated by molding material;
- and
- removing the mold insert produce a molded package around the component having an aperture above the component with dimensions determined by positioning of the encapsulated surfaces;
- wherein molding the component comprises performing a film-assisted molding process in which a molding film is disposed between the mold insert and the component while the mold insert contacts the substantially flat surfaces of the encapsulated areas.
4 more elements
A method of fabricating a device package, the method comprising:
- receiving a component on a substrate;
- encapsulating two or more edges of the component by bonding prefabricated elements to the substrate that overhang two or more edges of the component such that the prefabricated elements form encapsulated areas above a top surface of the component, the encapsulated areas having substantially flat surfaces;
- bringing a mold insert into contact with the substantially flat surfaces of the encapsulated areas;
- molding the component within a volume of molding material while the mold insert contacts the substantially flat surfaces of the encapsulated areas such that the component is encapsulated by molding material;
- and
- removing the mold insert produce a molded package around the component having an aperture above the component with dimensions determined by positioning of the encapsulated surfaces;
- wherein molding the component comprises performing a film-assisted molding process in which a molding film is disposed between the mold insert and the component while the mold insert contacts the substantially flat surfaces of the encapsulated areas.
4 more elements
A method of fabricating a device package, the method comprising:
- receiving a component;
- encapsulating two or more edges of the component by bonding prefabricated elements to the component that overhang two or more edges of the component such that the prefabricated elements form encapsulated areas above a top surface of the component, the encapsulated areas having substantially flat surfaces;
- bringing a mold insert into contact with the substantially flat surfaces of the encapsulated areas;
- molding the component within a volume of molding material while the mold insert contacts the substantially flat surfaces of the encapsulated areas such that the component is encapsulated by molding material;
- and
- removing the mold insert produce a molded package around the component having an aperture above the component with dimensions determined by positioning of the encapsulated surfaces;
- wherein molding the component comprises performing a film-assisted molding process in which a molding film is disposed between the mold insert and the component while the mold insert contacts the substantially flat surfaces of the encapsulated areas.
4 more elements
Dependencies are inferred from the claim text.