H10W 74/473
Containing a filler
Official title: {containing a filler}
H10W74/473 (Containing a filler) appears on 1,221 US grants and 1,645 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,221
- Published applications
- 1,645
- Assignees
- 437
- Inventors
- 3,317
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 4 | 0 |
| 1982 | 5 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 6 | 0 |
| 1990 | 4 | 0 |
| 1991 | 5 | 0 |
| 1992 | 8 | 0 |
| 1993 | 5 | 0 |
| 1994 | 7 | 0 |
| 1995 | 10 | 0 |
| 1996 | 5 | 0 |
| 1997 | 10 | 0 |
| 1998 | 5 | 0 |
| 1999 | 16 | 0 |
| 2000 | 4 | 0 |
| 2001 | 14 | 4 |
| 2002 | 13 | 19 |
| 2003 | 6 | 12 |
| 2004 | 16 | 19 |
| 2005 | 10 | 21 |
| 2006 | 12 | 26 |
| 2007 | 10 | 25 |
| 2008 | 13 | 39 |
| 2009 | 19 | 33 |
| 2010 | 22 | 42 |
| 2011 | 32 | 51 |
| 2012 | 33 | 66 |
| 2013 | 33 | 67 |
| 2014 | 57 | 57 |
| 2015 | 45 | 77 |
| 2016 | 63 | 93 |
| 2017 | 88 | 121 |
| 2018 | 83 | 73 |
| 2019 | 94 | 94 |
| 2020 | 56 | 111 |
| 2021 | 89 | 107 |
| 2022 | 63 | 89 |
| 2023 | 67 | 99 |
| 2024 | 64 | 116 |
| 2025 | 59 | 104 |
| 2026 | 50 | 80 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Patterned sheet MUF for complex packages and methods of producing6 Oct 2026US 12,757,781 B2Intel Corporation
- Semiconductor devices and methods of manufacturing semiconductor devices15 Sep 2026US 12,740,473 B2Amkor Technology Singapore Holding Pte.Ltd.
- Cleaning liquid and method for manufacturing semiconductor device8 Sep 2026US 12,729,348 B2Kabushiki Kaisha Toshiba
- Semiconductor device having a plurality of circuit patterns on a resin insulating layer25 Aug 2026US 12,721,164 B2Mitsubishi Electric Corporation
- Fan-out packaging structure and manufacturing method thereof18 Aug 2026US 12,713,929 B2Jcet Group Co., Ltd.
- Production method for boron nitride particles, production method for resin composition, and uses therefor8 Oct 2026US 2026/0307992 A1Resonac Corporation
- Power module with selective heat spreader8 Oct 2026US 2026/0314407 A1Microchip Technology Incorporated
- Semiconductor device and methods of manufacture8 Oct 2026US 2026/0314490 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method of forming non-conductive polymer layers with a controlled coefficient of thermal expansion1 Oct 2026US 2026/0305459 A1Inpack Technologies - Limited Partnership
- Memory packages with self-tuning protective material10 Sep 2026US 2026/0271773 A1Micron Technology, Inc.
Most cited
By later US patents
- Method for fabricating an integrated circuit module849US 5,353,498 AGeneral Electric Company · 1994
- Embedded substrate for integrated circuit modules421US 5,497,033 AMartin Marietta Corporation · 1996
- Plastic-encapsulated semiconductor device337US 5,641,997 AKabushiki Kaisha Toshiba · 1997
- Semiconductor device package and method215US 8,941,248 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Magnetic shielding of MRAM package190US 9,875,971 B2Globalfoundries Singapore Pte. Ltd. · 2018