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US 2026/0271773 A1Published application
Memory packages with self-tuning protective material
AssigneeMicron Technology, Inc.
InventorsChong Leong Gan, Min-Hua Chung, Mohamad Zainudeen Bin Moideen
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Abstract
Systems, methods, and apparatus are provided for a more reliable memory package. A particular memory package can comprise a substrate and a plurality of memory layers, the memory layers can be surrounded by an encapsulant. The encapsulant can have a number of surfaces coated in a self-tunable compound. The self-tunable compound can have a reduced elastic modulus at high temperatures resulting in decreased stress on components at higher temperatures.
Claims20
A memory package comprising:
- a substrate;
- a number of memory layers on the substrate;
- an encapsulant surrounding the number of memory layers;
- and
- a self-tunable compound capable of autonomously adjusting its elastic modulus in response to an external stimuli, the self-tunable compound coated on a first surface of the encapsulant opposite the substrate.
2 more elements
An electronic device, comprising:
- a memory package connected to circuitry of the electronic device, the memory package comprising:
- an underfill layer;
- a substrate on the underfill layer;
- a number of memory layers on the substrate;
- an encapsulant surrounding the memory layers;
- and
- a field’s metal hybrid elastomer (FMHE) coating a first surface of the encapsulant opposite to the substrate and the underfill layer.
4 more elements
An apparatus for storing data, the apparatus comprising:
- a substrate;
- a number of memory layers on the substrate;
- an encapsulant surrounding the number of memory layers;
- and
- a protective material comprising low melting point solids dispersed in an elastomer matrix surrounding the encapsulant.
2 more elements
Dependencies are inferred from the claim text.