Method of forming non-conductive polymer layers with a controlled coefficient of thermal expansion

Abstract

Disclosed herein is a method for forming a semiconductor device including a non-conductive polymer layer with a desired coefficient of thermal expansion (CTE), the method comprising: selecting/obtaining a desired CTE value, formulating a suspension comprising a mixture of dielectric nanoparticles and a curable polymer, the curable polymer is made of or comprises a resin and a hardener; wherein the resin of the curable polymer has a positive CTE, and the dielectric nanoparticles have a different CTE than the resin; wherein the formulating comprises determining a weight ratio the curable polymers and the dielectric nanoparticles, applying the suspension on a surface of a substrate, and curing the suspension to form a non-conductive polymer layer with the desired CTE value.

Dependencies are inferred from the claim text.