Fan-out packaging structure and manufacturing method thereof

A fan-out packaging structure, comprising a redistribution layer and at least one chip or chip-bearing package disposed on a first face of the redistribution layer, wherein:

• the redistribution layer comprises a grounding line layer;
• the fan-out packaging structure further comprises at least one plastic packaging layer, at least one first shielding layer and at least one electrical connector, the electrical connector being disposed on the first face of the redistribution layer, located on an outside of the chip or chip-bearing package, and electrically connected to the grounding line layer;
• the plastic packaging layer is disposed at least on the first face of the redistribution layer to encapsulate the electrical connector and the chip or chip-bearing package;
• the first shielding layer at least partially covers a side surface of the plastic packaging layer;
• and
• the electrical connector is at least partially exposed to the side surface of the plastic packaging layer and electrically connected to the first shielding layer, and the first shielding layer and the grounding line layer are electrically conductive to each other by means of the electrical connector;
• the electrical connector comprises a body member, and the body member is made of an organic polymer resin with an inorganic filler, or an organic polymer resin with a glass fiber cloth and a filler sheet;
• a first through-hole penetrating through upper and lower surfaces of the body member is disposed in a side of the body member facing a sidewall of the first shielding layer adjacent to the body member;
• and
• the first through-hole is filled with a conductive filler, a bottom of the body member is cladded with the conductive filler and is electrically connected to the grounding line layer, and side faces of the conductive filler are exposed from the plastic packaging layer and electrically connected to the first shielding layer, the conductive filler is a conductive adhesive comprising silver and/or copper, or a metal solder, a first metal layer or first metal layers is/are disposed on one or more of the upper and lower surfaces of the body member and a sidewall face of the first through-hole.