H10W 74/481
Comprising semiconductor materials
Official title: {comprising semiconductor materials}
H10W74/481 (Comprising semiconductor materials) appears on 96 US grants and 82 published applications in this corpus.
Search patents in H10W- Granted patents
- 96
- Published applications
- 82
- Assignees
- 66
- Inventors
- 254
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 4 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 4 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 4 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 1 | 1 |
| 2009 | 1 | 2 |
| 2010 | 0 | 0 |
| 2011 | 0 | 2 |
| 2012 | 1 | 0 |
| 2013 | 0 | 0 |
| 2014 | 1 | 3 |
| 2015 | 0 | 0 |
| 2016 | 2 | 3 |
| 2017 | 6 | 6 |
| 2018 | 8 | 5 |
| 2019 | 5 | 6 |
| 2020 | 6 | 9 |
| 2021 | 6 | 6 |
| 2022 | 4 | 5 |
| 2023 | 3 | 8 |
| 2024 | 1 | 11 |
| 2025 | 4 | 3 |
| 2026 | 8 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device including an organic film covering a projecting structure30 Jun 2026US 12,672,323 B2Rohm Co., Ltd.
- Mesa device with stack thin film passivation30 Jun 2026US 12,672,581 B2Littelfuse Semiconductor (Wuxi) Co., Ltd.
- Semiconductor structure and method for forming the same7 Apr 2026US 12,599,011 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Manufacturing method of diamond composite wafer31 Mar 2026US 12,593,688 B2Etron Technology, Inc.
- Semiconductor device17 Mar 2026US 12,581,693 B2Semiconductor Energy Laboratory Co.Ltd.
- Semiconductor device including an organic film covering a projecting structure24 Sep 2026US 2026/0293237 A1Rohm Co., Ltd.
- Stacked memory dies with protective barrier24 Sep 2026US 2026/0293749 A1SanDisk Technologies LLC
- Radio frequency high electron mobility transistors16 Jul 2026US 2026/0206250 A1Indian Institute of Science
- Semiconductor Device18 Jun 2026US 2026/0173458 A1Semiconductor Energy Laboratory Co.Ltd.
- Thermal Management in Integrated Circuit Using Phononic Bandgap Structure21 May 2026US 2026/0144136 A1Texas Instruments Incorporated
Most cited
By later US patents
- Multilayer semi-insulating film for hermetic wafer passivation and method for making same71US 4,901,133 ATexas Instruments Incorporated · 1990
- Interconnect structures70US 11,158,573 B2Invensas Bonding Technologies, Inc. · 2021
- Method of passivating pn-junction in a semiconductor device54US 4,375,125 AU. S. Philips Corporation · 1983
- Protective coating useful as passivation layer for semiconductor devices54US 4,972,250 AMicrowave Technology, Inc. · 1990
- Process of reducing density of fast surface states in MOS devices50US 4,331,709 ASiemens Aktiengesellschaft · 1982