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US 2026/0293749 A1Published application
Stacked memory dies with protective barrier
AssigneeSanDisk Technologies LLC
InventorsYangming Liu, Bo Yang, Ning Ye
Life of this patent
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Abstract
An apparatus includes a plurality of memory dies arranged in a stack with lateral offsets to form steps along a stepped side of the stack. Bond pads are located on the steps. Molding compound overlies the stack. A protective barrier extends between the molding compound and the stepped side of the stack.
Claims20
An apparatus comprising:
- a plurality of memory dies arranged in a stack with lateral offsets to form a plurality of steps along a stepped side of the stack;
- a plurality of bond pads located on the plurality of steps of the stepped side of the stack;
- a molding compound that overlies the stack;
- and
- a protective barrier that extends between the molding compound and the plurality of steps of the stepped side of the stack.
2 more elements
A method comprising:
- forming a stack of memory dies with lateral offsets such that bond pads of the memory dies are exposed along a stepped side of the stack;
- electrically connecting the bond pads of the memory dies with bond wires;
- and
- subsequently placing a portion of protective material over the stepped side of the stack, the bond pads and the bond wires.
1 more element
A storage system, comprising:
- a plurality of memory dies that are stacked along a first direction with offsets along a second direction to form a stack with steps along a stepped side of the stack;
- bond wires connecting bond pads that are located on the steps;
- a molding compound that overlies the stack;
- and
- means for physically separating the molding compound from the stepped side of the stack, the bond pads and the bond wires.
2 more elements
Dependencies are inferred from the claim text.