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US 2026/0144136 A1Published application
Thermal Management in Integrated Circuit Using Phononic Bandgap Structure
AssigneeTexas Instruments Incorporated
InventorsBenjamin Stassen Cook, Daniel Lee Revier
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Abstract
An encapsulated integrated circuit includes an integrated circuit (IC) die. An encapsulation material encapsulates the IC die. Within the encapsulation material, a phononic bandgap structure is configured to have a phononic bandgap with a frequency range approximately equal to a range of frequencies of thermal phonons produced by the IC die when the IC die is operating.
Claims1
An encapsulated integrated circuit comprising:
- an integrated circuit (IC) die;
- an encapsulation material encapsulating the IC die, and
- a phononic bandgap structure within the encapsulation material configured to have a phononic bandgap with a frequency range approximately equal to a range of frequencies of thermal phonons produced by the IC die when the IC die is operating.
Dependencies are inferred from the claim text.