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US 12,672,323 B2Granted
Semiconductor device including an organic film covering a projecting structure
AssigneeRohm Co., Ltd.
InventorYuki Nakano
Life of this patent
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Abstract
A semiconductor device includes a chip which has a first main surface on one side and a second main surface on the other side and which includes an active surface set at an inner portion of the first main surface and an outside surface set at a peripheral edge portion of the first main surface, a functional device which is formed at the active surface side, a projecting structure which includes an inorganic substance and projects at the outside surface side, and an organic film which covers the projecting structure.
Claims21
A semiconductor device comprising:
- a chip which has a first main surface on one side and a second main surface on the other side and which includes an active surface set at an inner portion of the first main surface and an outside surface set at a peripheral edge portion of the first main surface;
- a functional device which is formed at the active surface side;
- a projecting structure which includes an inorganic substance and projects at the outside surface side;
- an inorganic film which is constituted of an inorganic insulator and covers the projecting structure so as to form a part of the projecting structure and has at least one opening which selectively exposes a top surface of the projecting structure;
- and
- an organic film which covers the projecting structure and the inorganic film.
3 more elements
Dependencies are inferred from the claim text.