H10W 74/43
Comprising oxides, nitrides or carbides
Official title: comprising oxides, nitrides or carbides, e.g. ceramics or glasses
H10W74/43 (Comprising oxides, nitrides or carbides) appears on 1,106 US grants and 1,253 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,106
- Published applications
- 1,253
- Assignees
- 404
- Inventors
- 2,819
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 19 | 0 |
| 1977 | 12 | 0 |
| 1978 | 12 | 0 |
| 1979 | 8 | 0 |
| 1980 | 3 | 0 |
| 1981 | 2 | 0 |
| 1982 | 6 | 0 |
| 1983 | 3 | 0 |
| 1984 | 5 | 0 |
| 1985 | 5 | 0 |
| 1986 | 4 | 0 |
| 1987 | 5 | 0 |
| 1988 | 7 | 0 |
| 1989 | 6 | 0 |
| 1990 | 4 | 0 |
| 1991 | 12 | 0 |
| 1992 | 10 | 0 |
| 1993 | 6 | 0 |
| 1994 | 17 | 0 |
| 1995 | 6 | 0 |
| 1996 | 11 | 0 |
| 1997 | 12 | 0 |
| 1998 | 20 | 0 |
| 1999 | 8 | 0 |
| 2000 | 10 | 0 |
| 2001 | 5 | 2 |
| 2002 | 7 | 14 |
| 2003 | 9 | 10 |
| 2004 | 6 | 10 |
| 2005 | 12 | 11 |
| 2006 | 4 | 12 |
| 2007 | 8 | 14 |
| 2008 | 6 | 15 |
| 2009 | 9 | 14 |
| 2010 | 9 | 14 |
| 2011 | 11 | 14 |
| 2012 | 19 | 32 |
| 2013 | 21 | 51 |
| 2014 | 34 | 65 |
| 2015 | 51 | 56 |
| 2016 | 63 | 80 |
| 2017 | 74 | 97 |
| 2018 | 76 | 76 |
| 2019 | 70 | 79 |
| 2020 | 80 | 73 |
| 2021 | 55 | 83 |
| 2022 | 51 | 68 |
| 2023 | 47 | 93 |
| 2024 | 43 | 116 |
| 2025 | 57 | 83 |
| 2026 | 66 | 71 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of manufacturing a redistribution layer, redistribution layer, integrated circuit and methods for electrically testing and protecting the integrated circuit6 Oct 2026US 12,753,493 B2STMicroelectronics S,r.l.
- Semiconductor device6 Oct 2026US 12,757,782 B2Samsung Electronics Co., Ltd.
- Power semiconductor module29 Sep 2026US 12,751,317 B2Wuxi Leapers Semiconductor Co., Ltd.
- Protective coating on an edge of a glass core22 Sep 2026US 12,745,669 B2Intel Corporation
- RF devices with nanotube particles for enhanced performance and methods of forming the same15 Sep 2026US 12,740,412 B2Qorvo US, Inc.
- Semiconductor device having a layered source pad8 Oct 2026US 2026/0314377 A1Microchip Technology Incorporated
- Semiconductor structure8 Oct 2026US 2026/0314475 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method of filling gaps between dies using silicon dioxide8 Oct 2026US 2026/0314481 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package and method8 Oct 2026US 2026/0314498 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure and manufacturing method thereof1 Oct 2026US 2026/0305362 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Alumina insulation for coating implantable components and other microminiature devices490US 6,043,437 AAlfred E. Mann Foundation · 2000
- Multilayer ceramic coatings from silicate esters and metal oxides485US 4,753,856 ADow Corning Corporation · 1988
- Method of making a semiconductor device utilizing a light-sensitive etching agent477US 3,960,559 AFuji Photo Film Co., Ltd. · 1976
- System and method for gas-phase passivation of a semiconductor surface469US 9,911,676 B2ASM IP Holding B. V. · 2018
- Method of applying insulation for coating implantable components and other microminiature devices464US 6,472,122 B1Medtronic MiniMed, Inc. · 2002