H10W 74/10
Encapsulations: characterised by their shape or disposition
Official title: characterised by their shape or disposition
H10W74/10 (Encapsulations: characterised by their shape or disposition) appears on 42,233 US grants and 51,892 published applications in this corpus.
Search patents in H10W- Granted patents
- 42,233
- Published applications
- 51,892
- Assignees
- 3,583
- Inventors
- 42,047
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 20 | 0 |
| 1977 | 33 | 0 |
| 1978 | 24 | 0 |
| 1979 | 24 | 0 |
| 1980 | 29 | 0 |
| 1981 | 21 | 0 |
| 1982 | 22 | 0 |
| 1983 | 8 | 0 |
| 1984 | 17 | 0 |
| 1985 | 22 | 0 |
| 1986 | 28 | 0 |
| 1987 | 31 | 0 |
| 1988 | 29 | 0 |
| 1989 | 38 | 0 |
| 1990 | 43 | 0 |
| 1991 | 62 | 0 |
| 1992 | 79 | 0 |
| 1993 | 90 | 0 |
| 1994 | 122 | 0 |
| 1995 | 117 | 0 |
| 1996 | 155 | 0 |
| 1997 | 191 | 0 |
| 1998 | 328 | 0 |
| 1999 | 412 | 0 |
| 2000 | 438 | 0 |
| 2001 | 625 | 313 |
| 2002 | 725 | 980 |
| 2003 | 821 | 967 |
| 2004 | 858 | 1263 |
| 2005 | 861 | 1401 |
| 2006 | 921 | 1353 |
| 2007 | 867 | 1459 |
| 2008 | 846 | 1589 |
| 2009 | 872 | 1655 |
| 2010 | 1240 | 1640 |
| 2011 | 1353 | 1653 |
| 2012 | 1402 | 1787 |
| 2013 | 1598 | 1842 |
| 2014 | 1779 | 2120 |
| 2015 | 1936 | 2311 |
| 2016 | 2155 | 2228 |
| 2017 | 2250 | 2321 |
| 2018 | 2115 | 2290 |
| 2019 | 2261 | 2593 |
| 2020 | 2291 | 2980 |
| 2021 | 2152 | 2760 |
| 2022 | 2106 | 2828 |
| 2023 | 2197 | 2948 |
| 2024 | 2117 | 3323 |
| 2025 | 2039 | 3150 |
| 2026 | 1463 | 2138 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method of manufacturing a redistribution layer, redistribution layer, integrated circuit and methods for electrically testing and protecting the integrated circuit6 Oct 2026US 12,753,493 B2STMicroelectronics S,r.l.
- Nitride-based bidirectional switching device and method for manufacturing the same6 Oct 2026US 12,757,426 B2Innoscience (Suzhou) Semiconductor Co., Ltd.
- Image sensor package including a chip stack structure6 Oct 2026US 12,757,506 B2Samsung Electronics Co., Ltd.
- Package structure and manufacturing method thereof6 Oct 2026US 12,757,706 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated hybrid heat dissipation system that maximizes heat transfer from heterogeneous integration6 Oct 2026US 12,757,730 B2
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0312273 A1Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor storage device8 Oct 2026US 2026/0313798 A1Kioxia Corporation
- Die edge structure for molding compound filling and the methods of forming the same8 Oct 2026US 2026/0314288 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package structure and method for manufacturing the same8 Oct 2026US 2026/0314365 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Forming multiple tsvs with different formation schemes8 Oct 2026US 2026/0314368 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Analyte monitoring device and methods of use2,634US 6,175,752 B1TheraSense, Inc. · 2001
- Analyte monitoring device and methods of use2,053US 6,565,509 B1TheraSense, Inc. · 2003
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Non-protruding optoelectronic lens1,266US 6,525,386 B1Masimo Corporation · 2003
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015