H10W 74/131
The semiconductor body being only partially enclosed
Official title: {the semiconductor body being only partially enclosed}
H10W74/131 (The semiconductor body being only partially enclosed) appears on 11,682 US grants and 13,744 published applications in this corpus.
Search patents in H10W- Granted patents
- 11,682
- Published applications
- 13,744
- Assignees
- 1,393
- Inventors
- 14,990
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 14 | 0 |
| 1977 | 20 | 0 |
| 1978 | 17 | 0 |
| 1979 | 12 | 0 |
| 1980 | 18 | 0 |
| 1981 | 9 | 0 |
| 1982 | 14 | 0 |
| 1983 | 6 | 0 |
| 1984 | 10 | 0 |
| 1985 | 13 | 0 |
| 1986 | 14 | 0 |
| 1987 | 11 | 0 |
| 1988 | 14 | 0 |
| 1989 | 7 | 0 |
| 1990 | 14 | 0 |
| 1991 | 22 | 0 |
| 1992 | 18 | 0 |
| 1993 | 21 | 0 |
| 1994 | 20 | 0 |
| 1995 | 22 | 0 |
| 1996 | 43 | 0 |
| 1997 | 43 | 0 |
| 1998 | 61 | 0 |
| 1999 | 70 | 0 |
| 2000 | 70 | 0 |
| 2001 | 88 | 51 |
| 2002 | 122 | 168 |
| 2003 | 147 | 148 |
| 2004 | 132 | 186 |
| 2005 | 137 | 226 |
| 2006 | 150 | 217 |
| 2007 | 158 | 234 |
| 2008 | 133 | 293 |
| 2009 | 145 | 269 |
| 2010 | 225 | 302 |
| 2011 | 251 | 329 |
| 2012 | 274 | 420 |
| 2013 | 348 | 481 |
| 2014 | 467 | 651 |
| 2015 | 553 | 731 |
| 2016 | 699 | 726 |
| 2017 | 783 | 799 |
| 2018 | 718 | 741 |
| 2019 | 779 | 829 |
| 2020 | 772 | 1024 |
| 2021 | 722 | 1002 |
| 2022 | 738 | 1032 |
| 2023 | 815 | 857 |
| 2024 | 762 | 885 |
| 2025 | 655 | 698 |
| 2026 | 326 | 445 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 74/142The encapsulations exposing the passive side of the semiconductor body5,537
- H10W 74/137The encapsulations being directly on the semiconductor body2,765
- H10W 74/147The encapsulations being multilayered2,070
- H10W 74/141The encapsulations being on at least the sidewalls of the semiconductor body1,229
- H10W 74/134The encapsulations being in grooves in the semiconductor body436
- H10W 74/144The encapsulations comprising foils129
Recent patents
- Method of manufacturing a redistribution layer, redistribution layer, integrated circuit and methods for electrically testing and protecting the integrated circuit6 Oct 2026US 12,753,493 B2STMicroelectronics S,r.l.
- Nitride-based bidirectional switching device and method for manufacturing the same6 Oct 2026US 12,757,426 B2Innoscience (Suzhou) Semiconductor Co., Ltd.
- Chiplet-fine-interconnection-package structure and method of manufacturing the same6 Oct 2026US 12,757,767 B2Institute of Semiconductors, Guangdong Academy of Sciences
- Semiconductor device6 Oct 2026US 12,757,782 B2Samsung Electronics Co., Ltd.
- Semiconductor package comprising redistribution layer on wafer level chip scale package (WLCSP)6 Oct 2026US 12,757,805 B2Samsung Electronics Co., Ltd.
- Semiconductor package structure and method for manufacturing the same8 Oct 2026US 2026/0314365 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package8 Oct 2026US 2026/0314404 A1Samsung Electronics Co., Ltd.
- Integrated circuit packages and methods of forming the same8 Oct 2026US 2026/0314423 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Optical multi-chip interconnect bridge architecture and fabrication processes8 Oct 2026US 2026/0314433 A1Sicily Merger Sub II, Inc.
- Semiconductor package with an embedded interconnect and a method of making the same8 Oct 2026US 2026/0314436 A1Texas Instruments Incorporated
Most cited
By later US patents
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Package with metal-insulator-metal capacitor and method of manufacturing the same1,021US 9,263,511 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016