H10W 74/142
The encapsulations exposing the passive side of the semiconductor body
Official title: {the encapsulations exposing the passive side of the semiconductor body}
H10W74/142 (The encapsulations exposing the passive side of the semiconductor body) appears on 5,537 US grants and 6,395 published applications in this corpus.
Search patents in H10W- Granted patents
- 5,537
- Published applications
- 6,395
- Assignees
- 549
- Inventors
- 5,584
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 5 | 0 |
| 1996 | 8 | 0 |
| 1997 | 12 | 0 |
| 1998 | 14 | 0 |
| 1999 | 13 | 0 |
| 2000 | 26 | 0 |
| 2001 | 32 | 17 |
| 2002 | 56 | 83 |
| 2003 | 59 | 69 |
| 2004 | 72 | 94 |
| 2005 | 67 | 92 |
| 2006 | 82 | 87 |
| 2007 | 73 | 103 |
| 2008 | 48 | 144 |
| 2009 | 61 | 120 |
| 2010 | 113 | 129 |
| 2011 | 122 | 140 |
| 2012 | 117 | 183 |
| 2013 | 145 | 238 |
| 2014 | 205 | 284 |
| 2015 | 214 | 314 |
| 2016 | 323 | 329 |
| 2017 | 369 | 379 |
| 2018 | 347 | 361 |
| 2019 | 389 | 453 |
| 2020 | 411 | 574 |
| 2021 | 396 | 565 |
| 2022 | 416 | 569 |
| 2023 | 468 | 372 |
| 2024 | 424 | 345 |
| 2025 | 338 | 243 |
| 2026 | 97 | 108 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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Most cited
By later US patents
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- Package with metal-insulator-metal capacitor and method of manufacturing the same1,021US 9,263,511 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
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- Packaging methods and structures using a die attach film854US 9,064,879 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015