Packaged Semiconductor Device Including Liquid-Cooled Lid and Methods of Forming the Same

A device comprising:

• a substrate;
• a first integrated circuit die over the substrate;
• a second integrated circuit die over the substrate;
• an encapsulant over the substrate and laterally surrounding the first integrated circuit die and the second integrated circuit die;
• a lid on a side of the first integrated circuit die opposite the substrate, sidewalls of the lid being aligned with sidewalls of the first integrated circuit die, wherein a surface of the lid opposite the first integrated circuit die comprises a plurality of channels;
• a cooling cover over the lid, wherein the cooling cover extends over the second integrated circuit die;
• and
• a ring structure between the cooling cover and the substrate, the ring structure encircling the lid and the encapsulant.

A device comprising:

• a substrate;
• an interposer attached to the substrate, the interposer comprising conductive vias extending through the interposer;
• a first integrated circuit die on a first side of the interposer;
• a second integrated circuit die on the first side of the interposer laterally adjacent to the first integrated circuit die;
• an encapsulant laterally surrounding the first integrated circuit die and the second integrated circuit die;
• a lid on a side of the first integrated circuit die opposite the interposer, wherein the lid comprises a plurality of channels in a surface of the lid opposite the first integrated circuit die, wherein the second integrated circuit die is free of the lid;
• a cooling cover over the lid;
• and
• a ring structure between the cooling cover and the substrate, the ring structure laterally encircling the lid, the ring structure coupled to the cooling cover by a first adhesive and coupled to the substrate by a second adhesive, a side surface of the ring structure being aligned with a side surface of the cooling cover.