H10W 74/144
The encapsulations comprising foils
Official title: {the encapsulations comprising foils}
H10W74/144 (The encapsulations comprising foils) appears on 129 US grants and 106 published applications in this corpus.
Search patents in H10W- Granted patents
- 129
- Published applications
- 106
- Assignees
- 64
- Inventors
- 226
- Latest grant
- 1 Apr 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 4 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 3 | 0 |
| 1996 | 0 | 0 |
| 1997 | 4 | 0 |
| 1998 | 5 | 0 |
| 1999 | 6 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 2 |
| 2002 | 6 | 5 |
| 2003 | 0 | 5 |
| 2004 | 2 | 5 |
| 2005 | 6 | 7 |
| 2006 | 1 | 5 |
| 2007 | 7 | 4 |
| 2008 | 6 | 4 |
| 2009 | 1 | 7 |
| 2010 | 7 | 2 |
| 2011 | 2 | 10 |
| 2012 | 5 | 11 |
| 2013 | 8 | 2 |
| 2014 | 11 | 6 |
| 2015 | 4 | 5 |
| 2016 | 3 | 3 |
| 2017 | 5 | 6 |
| 2018 | 2 | 4 |
| 2019 | 7 | 1 |
| 2020 | 2 | 3 |
| 2021 | 0 | 1 |
| 2022 | 1 | 4 |
| 2023 | 3 | 2 |
| 2024 | 1 | 0 |
| 2025 | 3 | 2 |
By publication year. Applications have been published since 2001.
Recent patents
- Flip chip package unit and associated packaging method1 Apr 2025US 12,266,583 B2Chengdu Monolithic Power Systems Co., Ltd.
- Semiconductor device and method of fabricating the same4 Mar 2025US 12,243,798 B2Samsung Electronics Co., Ltd.
- Multi-chip package with recessed memory7 Jan 2025US 12,191,281 B2Intel Corporation
- Package having an electronic component and an encapsulant encapsulating a dielectric layer and a semiconductor die of the electronic component8 Oct 2024US 12,112,992 B2Infineon Technologies AG
- 3D flex-foil package19 Sep 2023US 11,764,122 B2Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e. V.
- Flip chip package unit and associated packaging method31 Jul 2025US 2025/0246445 A1Chengdu Monolithic Power Systems Co., Ltd.
- Method of Manufacturing a Package Having an Electronic Component and an Encapsulant Encapsulating a Dielectric Layer and a Semiconductor Die of the Electronic Component23 Jan 2025US 2025/0029884 A1Infineon Technologies AG
- Package Having an Electronic Component and an Encapsulant Encapsulating a Dielectric Layer and a Semiconductor Die of the Electronic Component15 Jun 2023US 2023/0187298 A1Infineon Technologies AG
- Semiconductor device and method of fabricating the same16 Mar 2023US 2023/0080328 A1Samsung Electronics Co., Ltd.
- Multi-chip package with recessed memory22 Dec 2022US 2022/0406753 A1Intel Corporation
Most cited
By later US patents
- Semiconductor chip assemblies with fan-in leads734US 5,148,265 AIST Associates, Inc. · 1992
- Semiconductor chip assemblies having interposer and flexible lead719US 5,148,266 AIST Associates, Inc. · 1992
- Semiconductor chip assemblies, methods of making same and components for same424US 5,679,977 ATessera, Inc. · 1997
- Semiconductor device286US 5,394,303 AKabushiki Kaisha Toshiba · 1995
- Semiconductor chip assemblies with face-up mounting and rear-surface connection to substrate259US 5,347,159 ATessera, Inc. · 1994