3D flex-foil package

A flexible foil-based package comprising:

• at least one flexible foil substrate comprising an electrically conductive layer arranged thereon, the at least one flexible foil substrate comprising a foil layer thickness DF of less than 130 μm,
• at east one electronic device comprising a device terminal side comprising at least one device terminal pad,
• wherein the at least one electronic device is mounted on the electrically conductive layer with no bond wire in flip-chip mounting technology so that the device terminal side of the at least one electronic device faces the electrically conductive layer,
• a plurality of package terminal pads being arranged on a package terminal side of the flexible foil-based package, the plurality of package terminal pads being configured for electrically contacting the flexible foil-based package,
• wherein at least one package terminal pad of the plurality of package terminal pads is in contact with the electrically conductive layer
• such that a signal path is provided between the at least one package terminal pad and the electrically conductive layer and the at least one device terminal pad, and
• such that the at least one electronic device is electrically contactable from a side of the at least one flexible foil substrate that faces the at least one electronic device by means of the at least one package terminal pad,
• wherein the at least one flexible foil substrate comprises a first foil portion at which the at least one package terminal pad is arranged, and wherein the at least one flexible foil substrate comprises a second foil portion at which the at least one electronic device is arranged,
• wherein the first foil portion extends along a first foil plane and wherein the second foil portion extends along a second foil plane that is parallel to the first foil plane,
• wherein the first foil plane and the second foil plane are offset relative to each other such that the at least one flexible foil substrate forms a recess within which the at least one electronic device is arranged,
• wherein the first foil portion comprises a foil surface facing the plurality of package terminal pads, wherein said foil surface defines a foil surface level,
• wherein the at least one electronic device comprises a device surface opposite the device terminal side, wherein said device surface is located at or below said foil surface level such that the at least one electronic device is arranged completely within the recess, and
• wherein the flexible foil-based package further comprises a casting compound arranged between the first foil portion and the second foil portion, wherein the casting compound surrounds at least a portion of the plurality of package terminal pads and covers the at least one electronic device in order to separate the electronic device from a surrounding environment.