Package Having an Electronic Component and an Encapsulant Encapsulating a Dielectric Layer and a Semiconductor Die of the Electronic Component

Abstract

A package includes: an electronic component that includes a dielectric layer as a base and a semiconductor die attached on top of the dielectric layer, the semiconductor die having an active area with monolithically integrated circuit elements; and an encapsulant encapsulating the dielectric layer and the semiconductor die. The encapsulant is a mold compound having different material properties than the dielectric layer. A method of manufacturing package is also described.

Dependencies are inferred from the claim text.