Back to results
US 12,112,992 B2Granted
Package having an electronic component and an encapsulant encapsulating a dielectric layer and a semiconductor die of the electronic component
AssigneeInfineon Technologies AG
InventorsDaniel Porwol, Thomas Fischer, Uwe Seidel, Anton Steltenpohl
Life of this patent
Estimating the term…
Abstract
A package includes: an electronic component that includes a dielectric layer as a base and a semiconductor die attached on top of the dielectric layer, the semiconductor die having an active area with monolithically integrated circuit elements; and an encapsulant encapsulating the dielectric layer and the semiconductor die. The encapsulant is a mold compound having different material properties than the dielectric layer. A method of manufacturing package is also described.
Claims20
A package, comprising:
- an electronic component that includes a dielectric layer as a base and a semiconductor die attached on top of the dielectric layer, the semiconductor die having an active area with monolithically integrated circuit elements;
- and
- an encapsulant encapsulating the dielectric layer and the semiconductor die,
- wherein the encapsulant is a mold compound having different material properties than the dielectric layer, and
- wherein the electronic component further includes an adhesive layer that further promotes adhesion between the dielectric layer and the semiconductor die.
2 more elements
A method of manufacturing a package, the method comprising:
- providing an electronic component that includes a dielectric layer as a base and a semiconductor die attached on top of the dielectric layer, the semiconductor die having an active area with monolithically integrated circuit elements;
- and
- encapsulating the dielectric layer and the semiconductor die by an encapsulant,
- wherein the encapsulant is a mold compound having different material properties than the dielectric layer, and
- wherein the electronic component further includes an adhesive layer that further promotes adhesion between the dielectric layer and the semiconductor die.
2 more elements
A package, comprising:
- an electronic component that includes a dielectric layer as a base and a semiconductor die attached on top of the dielectric layer, the semiconductor die having an active area with monolithically integrated circuit elements;
- and
- an encapsulant encapsulating the dielectric layer and the semiconductor die,
- wherein the encapsulant is a mold compound having different material properties than the dielectric layer, and
- wherein the dielectric layer comprises a polymer.
2 more elements
Dependencies are inferred from the claim text.