H10W 74/137
The encapsulations being directly on the semiconductor body
Official title: {the encapsulations being directly on the semiconductor body (H10W74/134 takes precedence)}
H10W74/137 (The encapsulations being directly on the semiconductor body) appears on 2,765 US grants and 3,225 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,765
- Published applications
- 3,225
- Assignees
- 689
- Inventors
- 6,015
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 13 | 0 |
| 1978 | 9 | 0 |
| 1979 | 7 | 0 |
| 1980 | 9 | 0 |
| 1981 | 6 | 0 |
| 1982 | 8 | 0 |
| 1983 | 4 | 0 |
| 1984 | 8 | 0 |
| 1985 | 8 | 0 |
| 1986 | 10 | 0 |
| 1987 | 7 | 0 |
| 1988 | 9 | 0 |
| 1989 | 3 | 0 |
| 1990 | 2 | 0 |
| 1991 | 7 | 0 |
| 1992 | 3 | 0 |
| 1993 | 8 | 0 |
| 1994 | 10 | 0 |
| 1995 | 9 | 0 |
| 1996 | 23 | 0 |
| 1997 | 17 | 0 |
| 1998 | 30 | 0 |
| 1999 | 27 | 0 |
| 2000 | 26 | 0 |
| 2001 | 29 | 21 |
| 2002 | 30 | 33 |
| 2003 | 47 | 39 |
| 2004 | 26 | 30 |
| 2005 | 26 | 42 |
| 2006 | 23 | 53 |
| 2007 | 23 | 36 |
| 2008 | 27 | 47 |
| 2009 | 30 | 55 |
| 2010 | 38 | 59 |
| 2011 | 45 | 75 |
| 2012 | 56 | 94 |
| 2013 | 78 | 91 |
| 2014 | 98 | 144 |
| 2015 | 129 | 158 |
| 2016 | 157 | 171 |
| 2017 | 185 | 197 |
| 2018 | 160 | 175 |
| 2019 | 168 | 199 |
| 2020 | 197 | 247 |
| 2021 | 172 | 198 |
| 2022 | 134 | 215 |
| 2023 | 160 | 265 |
| 2024 | 172 | 264 |
| 2025 | 174 | 204 |
| 2026 | 113 | 113 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Nitride-based bidirectional switching device and method for manufacturing the same6 Oct 2026US 12,757,426 B2Innoscience (Suzhou) Semiconductor Co., Ltd.
- Semiconductor device6 Oct 2026US 12,757,782 B2Samsung Electronics Co., Ltd.
- Semiconductor package comprising redistribution layer on wafer level chip scale package (WLCSP)6 Oct 2026US 12,757,805 B2Samsung Electronics Co., Ltd.
- Dual-gate semiconductor structures for power applications29 Sep 2026US 12,751,034 B2Qorvo US, Inc.
- Power diode device and method of manufacturing the same15 Sep 2026US 12,740,078 B2Diodes Incorporated
- Semiconductor device and method of testing the same1 Oct 2026US 2026/0305266 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Microelectronic device package with open cavity1 Oct 2026US 2026/0305456 A1Texas Instruments Incorporated
- Stacked devices and methods of fabrication1 Oct 2026US 2026/0305491 A1Adeia Semiconductor Bonding Technologies Inc.
- Method for manufacturing semiconductor device and semiconductor device1 Oct 2026US 2026/0305501 A1Resonac Corporation
- Circuit device with embedded heat sink24 Sep 2026US 2026/0293668 A1
Most cited
By later US patents
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method for fabricating an integrated circuit module849US 5,353,498 AGeneral Electric Company · 1994
- Method of fabricating a semiconductor device having a silicon nitride film made of silane, ammonia and nitrogen564US 5,877,095 ANippondenso Co., Ltd. · 1999
- Semiconductor device having laminated tight and coarse insulating layers509US 5,523,616 ANEC Corporation · 1996
- Multilayer ceramic coatings from silicate esters and metal oxides485US 4,753,856 ADow Corning Corporation · 1988