Semiconductor package comprising redistribution layer on wafer level chip scale package (WLCSP)

A semiconductor package, comprising:

• A semiconductor chip having chip pads disposed on a first surface thereof;
• a redistribution wiring layer covering the first surface of the semiconductor chip and having redistribution wirings electrically connected to the chip pads;
• and
• conductive bumps disposed on an outer surface of the redistribution wiring layer and electrically connected to the redistribution wirings,
• wherein the redistribution wiring layer includes:
• at least one insulating layer in which the redistribution wirings are provided;
• a protective layer provided on the at least one insulating layer and having an opening that exposes at least a portion of a first redistribution wiring among the redistribution wirings;
• and
• a bonding pad provided on the at least a portion of the first redistribution wiring that is exposed by the opening of the protective layer and spaced apart from an inner wall of the opening of the protective layer, and
• wherein a conductive bump of the conductive bumps is disposed on the bonding pad,
• wherein the conductive bumps contact a portion of the redistribution wiring that is exposed by the opening of the protective layer.

A semiconductor package, comprising:

• a redistribution wiring layer having a first surface and a second surface that is opposite to the first surface, wherein the redistribution wiring layer includes at least one insulating layer and redistribution wirings provided in the at least one insulating layer;
• a semiconductor chip arranged on the first surface of the redistribution wiring layer and having chip pads that are electrically connected to the redistribution wirings;
• and
• outer connection members disposed on the second surface of the redistribution wiring layer and electrically connected to the redistribution wirings,
• wherein the redistribution wiring layer further includes:
• a protective layer provided on the at least one insulating layer and having an opening that exposes at least a portion of a first redistribution wiring among the redistribution wirings;
• and
• a bonding pad provided on the at least a portion of the first redistribution wiring that is exposed by the opening of the protective layer and is spaced apart from an inner wall of the opening of the protective layer, and
• wherein an outer connection member of outer connection members is arranged on the bonding pad and covers a portion of the first redistribution wiring that is exposed by the bonding pad,
• wherein an outer connection member of outer connection members contacts a portion of the at least a portion of the first redistribution wiring that is exposed by the opening of the protective layer.