Semiconductor device and method of testing the same

A method, comprising:

• receiving a semiconductor wafer including a first device and a second device adjacent to the first device;
• and
• forming a test metal pattern between the first device and the second device, wherein the test metal pattern includes:
• a first set of lines extending into a first top edge of the first device and a second set of lines extending into a second top edge of the second device facing the first top edge;
• and
• a first set of probing portions electrically coupled to the respective first set of lines and a second set of probing portions electrically coupled to the respective second set of lines.

A method, comprising:

• forming an interconnect structure on a semiconductor device, the interconnect structure comprising a seal ring laterally surrounding the semiconductor device from a top-view perspective;
• forming a metal pattern in the interconnect structure and crossing the seal ring, the metal pattern including:
• a first pad, a second pad and a third pad at a first top edge of the semiconductor device;
• and
• a fourth pad and a fifth pad at a second top edge of the semiconductor device, wherein the second top edge is adjacent to the first top edge from a top-view perspective.