H10W 74/134
The encapsulations being in grooves in the semiconductor body
Official title: {the encapsulations being in grooves in the semiconductor body}
H10W74/134 (The encapsulations being in grooves in the semiconductor body) appears on 436 US grants and 511 published applications in this corpus.
Search patents in H10W- Granted patents
- 436
- Published applications
- 511
- Assignees
- 194
- Inventors
- 1,052
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 4 | 0 |
| 1979 | 1 | 0 |
| 1980 | 6 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 3 |
| 2002 | 2 | 2 |
| 2003 | 4 | 2 |
| 2004 | 3 | 2 |
| 2005 | 1 | 5 |
| 2006 | 2 | 3 |
| 2007 | 5 | 5 |
| 2008 | 4 | 6 |
| 2009 | 3 | 6 |
| 2010 | 4 | 16 |
| 2011 | 7 | 13 |
| 2012 | 8 | 10 |
| 2013 | 12 | 19 |
| 2014 | 17 | 28 |
| 2015 | 28 | 29 |
| 2016 | 34 | 48 |
| 2017 | 34 | 39 |
| 2018 | 36 | 21 |
| 2019 | 19 | 22 |
| 2020 | 30 | 37 |
| 2021 | 23 | 33 |
| 2022 | 22 | 26 |
| 2023 | 28 | 33 |
| 2024 | 27 | 41 |
| 2025 | 22 | 32 |
| 2026 | 18 | 30 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
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- Thermal dissipation of integrated circuits using diamond paths103US 5,313,094 AInternational Business Machines Corporation · 1994
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