Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

A stacked microelectronic device assembly, comprising:

• a first known good packaged microelectronic device including (a) a first interposer substrate with a plurality of first interposer contacts, (b) a first die carried by and electrically coupled to the first interposer substrate, wherein the first die includes an active side facing away from the first interposer substrate and a plurality of first terminals at the active side of the first die and electrically coupled to the first interposer substrate with a plurality of first wire bonds, (c) a first casing having a first face at the first interposer substrate and a second face opposite the first face such that the first casing completely encapsulates the first die and at least a portion of the first interposer substrate, and (d) a plurality of first through-casing interconnects at least partially encapsulated in the first casing and in contact with corresponding first interposer contacts, wherein the first interconnects extend from the first face to the second face;
• and
• a second known good packaged microelectronic device coupled to the first device in a stacked configuration, the second device including (a) a second interposer substrate with a plurality of second interposer pads, (b) a second die carried by and electrically coupled to the second interposer substrate, wherein the second die includes an active side facing away from the second interposer substrate and a plurality of second terminals at the active side of the second die and electrically coupled to the second interposer substrate with a plurality of second wire bonds, and (c) a second casing that completely encapsulates the second die and at least a portion of the second interposer substrate, wherein the second interposer pads are in direct contact with and electrically coupled to exposed portions of the corresponding first interconnects at the second face of the first casing.