Element package and semiconductor device

A semiconductor device comprising:

• an element package;
• a heat dissipation member;
• and
• a signal terminal, wherein
• the element package includes:
• a semiconductor element that includes a semiconductor substrate, a main electrode, a pad, and a protective film, the semiconductor substrate having an element region formed with an element and a scribe region disposed in a predetermined area from an end portion of the semiconductor substrate and surrounding the element region, the main electrode and the pad being disposed on a surface of the semiconductor substrate, the protective film being disposed above the element region on the surface of the semiconductor substrate so that the main electrode and the pad are exposed from the protective film;
• a sealing resin body that seals the semiconductor element so that the main electrode and the pad are exposed from the sealing resin body;
• a redistribution layer that includes an insulator and a wiring disposed in the insulator, and is disposed adjacent to the surface of the semiconductor substrate with respect to the semiconductor element;
• an insulating portion that is disposed above the scribe region on the surface of the semiconductor element with a height that does not exceed an outer peripheral edge portion of an upper surface of the protective film on the element region, wherein
• the redistribution layer is disposed to extend over the protective film and the insulator,
• the wiring includes a signal wiring connected to the pad,
• the signal wiring is disposed to extend over a boundary between the element region and the scribe region in a plan view in a thickness direction of the semiconductor substrate,
• the heat dissipation member is disposed to interpose the semiconductor element in the thickness direction, and
• the signal terminal is joined to a terminal portion of the signal wiring exposed from the insulator, and is electrically connected to the pad through the signal wiring.

A semiconductor device comprising:

• an element package;
• a heat dissipation member;
• and
• a signal terminal, wherein
• the element package includes:
• a semiconductor element that includes a semiconductor substrate, a main electrode and a pad, the semiconductor substrate having an element region formed with an element and a scribe region disposed in a predetermined area from an end portion of the semiconductor substrate and surrounding the element region, the main electrode and the pad being disposed on a surface of the semiconductor substrate;
• a sealing resin body that seals the semiconductor element so that the main electrode and the pad are exposed from the sealing resin body;
• a redistribution layer that is disposed adjacent to the surface of the semiconductor substrate with respect to the semiconductor element, and includes an insulator and a wiring disposed in the insulator, wherein
• the insulator is in contact with the surface of the semiconductor substrate over the element region and the scribe region,
• the wiring includes a signal wiring connected to the pad, and
• the signal wiring is disposed to extend over a boundary between the element region and the scribe region in a plan view in a thickness direction of the semiconductor substrate,
• the heat dissipation member is disposed to interpose the semiconductor element in the thickness direction, and
• the signal terminal is joined to a terminal portion of the signal wiring exposed from the insulator, and is electrically connected to the pad through the signal wiring.