Semiconductor device package with flat plate and pin terminals

A semiconductor device, comprising:

• an insulating substrate;
• a first conductor portion and a second conductor portion that are formed on the insulating substrate;
• a semiconductor element disposed on the first conductor portion;
• a first terminal formed of a flat plate connected to a first electrode of the semiconductor element;
• a second terminal formed of a flat plate connected to the first conductor portion;
• a connection member electrically connecting a control electrode of the semiconductor element to the second conductor portion;
• a support member formed of a flat plate disposed at a predetermined distance from the second conductor portion;
• a pin terminal having a rod shape that is supported in a state of being inserted through the support member and connected to the second conductor portion;
• and
• a sealing resin that seals the insulating substrate, the first conductor portion, the second conductor portion, the semiconductor element, the connection member, and the support member;
• wherein the support member supports the insulating substrate to which the first terminal, the second terminal, the connection member, and the pin terminals are bonded, via the pin terminal by connected to the pin terminal as a part of a lead frame when manufacturing the semiconductor device, and then, the support member is formed by cut off from the lead frame.