Semiconductor package structure and method for manufacturing the same

A semiconductor package structure comprising:

• a package structure comprising:
• a molding compound;
• a passive device component disposed in the molding compound;
• a first connection structure disposed over the molding compound;
• a second connection structure disposed under the molding compound;
• a via disposed in the molding compound and electrically coupled to the first connection structure and the second connection structure;
• a first conductor disposed over the first connection structure;
• and
• a second conductor disposed under the second connection structure;
• and
• at least a die electrically coupled to the package structure through the first conductor.

A method for forming a semiconductor package structure, comprising:

• receiving a plurality of first package structures, wherein each first package structure comprises a first connection structure, a second connection structure, a molding compound disposed between the first connection structure and the second connection structure, a passive device component disposed in the molding compound, a via disposed in the molding compound and electrically coupled to the first connection structure and the second connection structure, and a first conductor coupled to the first connection structure;
• bonding the first conductors of the first package structures to a semiconductor substrate;
• forming an underfill between the semiconductor substrate and the first package structures;
• and
• singulating the first package structures, the underfill and the semiconductor substate to form a second package structure.