H10W 74/147
The encapsulations being multilayered
Official title: {the encapsulations being multilayered}
H10W74/147 (The encapsulations being multilayered) appears on 2,070 US grants and 2,571 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,070
- Published applications
- 2,571
- Assignees
- 467
- Inventors
- 4,084
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 7 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 6 | 0 |
| 1981 | 2 | 0 |
| 1982 | 4 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 5 | 0 |
| 1999 | 10 | 0 |
| 2000 | 8 | 0 |
| 2001 | 15 | 3 |
| 2002 | 13 | 22 |
| 2003 | 17 | 22 |
| 2004 | 12 | 26 |
| 2005 | 21 | 45 |
| 2006 | 21 | 37 |
| 2007 | 27 | 53 |
| 2008 | 33 | 58 |
| 2009 | 29 | 54 |
| 2010 | 39 | 52 |
| 2011 | 42 | 74 |
| 2012 | 49 | 86 |
| 2013 | 74 | 88 |
| 2014 | 97 | 176 |
| 2015 | 145 | 177 |
| 2016 | 157 | 142 |
| 2017 | 160 | 142 |
| 2018 | 134 | 121 |
| 2019 | 122 | 117 |
| 2020 | 111 | 140 |
| 2021 | 116 | 164 |
| 2022 | 122 | 177 |
| 2023 | 129 | 184 |
| 2024 | 111 | 167 |
| 2025 | 116 | 155 |
| 2026 | 79 | 89 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of manufacturing a redistribution layer, redistribution layer, integrated circuit and methods for electrically testing and protecting the integrated circuit6 Oct 2026US 12,753,493 B2STMicroelectronics S,r.l.
- Nitride-based bidirectional switching device and method for manufacturing the same6 Oct 2026US 12,757,426 B2Innoscience (Suzhou) Semiconductor Co., Ltd.
- Dual-gate semiconductor structures for power applications29 Sep 2026US 12,751,034 B2Qorvo US, Inc.
- Die package structure and method for forming the same29 Sep 2026US 12,751,314 B2Winbond Electronics Corp.
- Semiconductor device preventing insulating layer peeling and method of manufacturing semiconductor device15 Sep 2026US 12,740,392 B2Sumitomo Electric Device Innovations, Inc.
- Semiconductor device and method of fabricating semiconductor package8 Oct 2026US 2026/0314476 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package having a multi-layer film structure8 Oct 2026US 2026/0314477 A1SanDisk Technologies LLC
- Semiconductor device with reduced warpage8 Oct 2026US 2026/0314478 A1Samsung Electronics Co., Ltd.
- Foundry Compatible, Ultra-low Resistance, Under-Bump-Metallization for Electroplated Bumps8 Oct 2026US 2026/0314479 A1
- Integrated circuit structure and manufacturing method thereof8 Oct 2026US 2026/0314480 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Packages with passive devices and methods of forming the same592US 8,680,647 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Package with a fan-out structure and method of forming the same579US 8,785,299 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Package with passive devices and method of forming the same576US 8,809,996 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Semiconductor device having laminated tight and coarse insulating layers509US 5,523,616 ANEC Corporation · 1996