Die package structure and method for forming the same
AssigneeWinbond Electronics Corp.
InventorsYu-Cheng Chen, Jin-Neng Wu
Life of this patent
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Abstract
A method for forming a die package structure, including disposing a plurality of dies on a carrier substrate, wherein the top surface of each die has a plurality of signal junctions. The method also includes forming a vertical wire on each of the signal junctions, forming a supporting dielectric layer on the carrier substrate, wherein the supporting dielectric layer covers the dies and exposes the top of the vertical wires, and forming a plurality of redistribution traces on the supporting dielectric layer, wherein the redistribution traces are electrically connected to each of the vertical wires. The method further includes forming a bump at the bonding site of each of the redistribution traces, and performing a cutting process to singulate the dies.
Claims9
A die package structure, comprising:
- a die with a plurality of signal junctions on a top surface of the die;
- a plurality of vertical wires formed over the signal junctions of the die, respectively;
- a supporting dielectric layer covering the die and burying the vertical wires into the supporting dielectric layer, and exposing a top of the vertical wires;
- a first insulating layer disposed on the supporting dielectric layer and exposing a top surface of the vertical wires, wherein a thermal expansion coefficient of the supporting dielectric layer is greater than a thermal expansion coefficient of the first insulating layer;
- a plurality of redistribution traces formed on the first insulating layer and electrically connected to the vertical wires, respectively;
- a plurality of bumps formed at a bonding site of each of the redistribution traces, respectively;
- a patterned dielectric layer disposed on the first insulating layer, wherein the redistribution traces are embedded in the patterned dielectric layer;
- and
- a second insulating layer disposed on the patterned dielectric layer and exposing the bonding sites of the redistribution traces, wherein the die comprises at least two signal junctions, at least two vertical wires, at least two redistribution traces, and at least two bumps.
Dependencies are inferred from the claim text.