Electronic devices and methods of manufacturing electronic devices

An electronic device, comprising:

• a substrate comprising:
• a substrate first side;
• a substrate second side opposite to the substrate first side;
• a dielectric structure;
• and
• a conductive structure within the dielectric structure;
• a plurality of antenna feed structures coupled to the conductive structure at the substrate first side and comprising a first antenna feed structure, a second antenna feed structure, and a third antenna feed structure;
• a top encapsulant covering the plurality of antenna feed structures and the substrate first side and comprising:
• a top encapsulant outer side;
• and
• a plurality of recessed regions extending inward from the top encapsulant outer side and comprising a first recessed region comprising a first lower side, a second recessed region comprising a second lower side, and a third recessed region comprising a third lower side;
• a plurality of antenna patterns comprising a first antenna pattern adjacent to the first lower side and coupled to the first antenna feed structure, a second antenna pattern adjacent to the second lower side and coupled to the second antenna feed structure, a third antenna pattern adjacent to the third lower side and coupled to the third antenna feed structure;
• electronic components coupled to the conductive structure at the substrate second side;
• and
• a bottom encapsulant covering the electronic components and the substrate second side.

A method of manufacturing an electronic device, comprising:

• providing a substrate comprising:
• a substrate first side;
• a substrate second side opposite to the substrate first side;
• a dielectric structure;
• and
• a conductive structure within the dielectric structure;
• providing a plurality of antenna feed structures coupled to the conductive structure at the substrate first side and comprising a first antenna feed structure, a second antenna feed structure, and a third antenna feed structure;
• providing a top encapsulant covering the plurality of antenna feed structures and the substrate first side and comprising:
• a top encapsulant outer side;
• and
• a plurality of recessed regions extending inward from the top encapsulant outer side and comprising a first recessed region comprising a first lower side, a second recessed region comprising a second lower side, and a third recessed region comprising a third lower side;
• providing a plurality of antenna patterns comprising a first antenna pattern adjacent to the first lower side and coupled to the first antenna feed structure, a second antenna pattern adjacent to the second lower side and coupled to the second antenna feed structure, a third antenna pattern adjacent to the third lower side and coupled to the third antenna feed structure;
• providing electronic components coupled to the conductive structure at the substrate second side;
• and
• providing a bottom encapsulant covering the electronic components and the substrate second side.