H10W 74/111
The semiconductor body being completely enclosed
Official title: {the semiconductor body being completely enclosed}
H10W74/111 (The semiconductor body being completely enclosed) appears on 27,121 US grants and 34,045 published applications in this corpus.
Search patents in H10W- Granted patents
- 27,121
- Published applications
- 34,045
- Assignees
- 2,425
- Inventors
- 27,468
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 15 | 0 |
| 1978 | 8 | 0 |
| 1979 | 15 | 0 |
| 1980 | 14 | 0 |
| 1981 | 13 | 0 |
| 1982 | 10 | 0 |
| 1983 | 2 | 0 |
| 1984 | 9 | 0 |
| 1985 | 11 | 0 |
| 1986 | 10 | 0 |
| 1987 | 16 | 0 |
| 1988 | 13 | 0 |
| 1989 | 24 | 0 |
| 1990 | 20 | 0 |
| 1991 | 26 | 0 |
| 1992 | 39 | 0 |
| 1993 | 44 | 0 |
| 1994 | 73 | 0 |
| 1995 | 68 | 0 |
| 1996 | 76 | 0 |
| 1997 | 111 | 0 |
| 1998 | 183 | 0 |
| 1999 | 216 | 0 |
| 2000 | 232 | 0 |
| 2001 | 328 | 162 |
| 2002 | 391 | 577 |
| 2003 | 453 | 568 |
| 2004 | 515 | 786 |
| 2005 | 530 | 832 |
| 2006 | 572 | 800 |
| 2007 | 523 | 890 |
| 2008 | 500 | 977 |
| 2009 | 548 | 1033 |
| 2010 | 771 | 1071 |
| 2011 | 863 | 1082 |
| 2012 | 892 | 1147 |
| 2013 | 1030 | 1139 |
| 2014 | 1103 | 1264 |
| 2015 | 1245 | 1477 |
| 2016 | 1374 | 1466 |
| 2017 | 1450 | 1528 |
| 2018 | 1419 | 1548 |
| 2019 | 1511 | 1813 |
| 2020 | 1576 | 2086 |
| 2021 | 1510 | 1848 |
| 2022 | 1453 | 1882 |
| 2023 | 1463 | 2038 |
| 2024 | 1417 | 2378 |
| 2025 | 1417 | 2220 |
| 2026 | 1014 | 1433 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Image sensor package including a chip stack structure6 Oct 2026US 12,757,506 B2Samsung Electronics Co., Ltd.
- Package structure and manufacturing method thereof6 Oct 2026US 12,757,706 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Package structures and methods of manufacturing the same6 Oct 2026US 12,757,734 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Packaging structure having organic interposer layer and method for manufacturing same6 Oct 2026US 12,757,749 B2SJ Semiconductor(Jiangyin) Corporation
- Semiconductor package assembly with electric field modulation structures6 Oct 2026US 12,757,751 B2Nexperia B. V.
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0312273 A1Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor storage device8 Oct 2026US 2026/0313798 A1Kioxia Corporation
- Die edge structure for molding compound filling and the methods of forming the same8 Oct 2026US 2026/0314288 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Forming multiple tsvs with different formation schemes8 Oct 2026US 2026/0314368 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Lid Structure With Openings To Alleviate Leakage Of Thermal Interface Material Of A Chip Assembly8 Oct 2026US 2026/0314397 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Analyte monitoring device and methods of use2,634US 6,175,752 B1TheraSense, Inc. · 2001
- Analyte monitoring device and methods of use2,053US 6,565,509 B1TheraSense, Inc. · 2003
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Package systems having interposers1,064US 9,048,233 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015