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H10W 74/129

Forming a chip-scale package [csp]

Official title: {forming a chip-scale package [CSP]}

H10W74/129 (Forming a chip-scale package [csp]) appears on 5,321 US grants and 6,069 published applications in this corpus.

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Granted patents
5,321
Published applications
6,069
Assignees
750
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6,495
Latest grant
6 Oct 2026

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H10W 74/129: granted patents and published applications per publication year
YearGranted patentsPublished applications
199620
199750
199880
1999230
2000360
20017244
200299167
2003140163
2004123239
2005158271
2006162252
2007150199
2008152212
2009147201
2010180183
2011159176
2012159168
2013164174
2014161216
2015210296
2016339375
2017375437
2018376418
2019400418
2020370399
2021268285
2022262215
2023211167
2024190188
2025161142
20265964

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