Antenna package
AssigneeMediatek Inc.
InventorChung-Hsin Chiang
Life of this patent
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Abstract
An antenna package includes a redistribution layer (RDL) structure having a top surface and a bottom surface opposite to the top surface and a TSV die disposed on the top surface of the RDL structure and encapsulated by a molding compound. The TSV die includes an active side and a rear side, and a sidewall of the TSV die is covered with the molding compound. The TSV die includes a plurality of through-silicon-vias including RF signal vias and ground vias penetrating through an entire thickness of the TSV die. An antenna structure is disposed on the rear side of the TSV die and is connected to the RF signal vias and ground vias.
Claims12
An antenna package, comprising:
- a redistribution layer (RDL) structure having a top surface and a bottom surface opposite to the top surface;
- a through-silicon-via (TSV) die disposed on the top surface of the RDL structure, wherein the TSV die comprises an active side and a rear side, wherein the TSV die comprises a plurality of through-silicon-vias comprising RF signal vias and ground vias penetrating through an entire thickness of the TSV die;
- and
- an antenna structure disposed on the rear side of the TSV die and connecting to the RF signal vias and ground vias.
Dependencies are inferred from the claim text.