H10W 74/124
The encapsulations having cavities other than that occupied by chips
Official title: {the encapsulations having cavities other than that occupied by chips}
H10W74/124 (The encapsulations having cavities other than that occupied by chips) appears on 637 US grants and 776 published applications in this corpus.
Search patents in H10W- Granted patents
- 637
- Published applications
- 776
- Assignees
- 249
- Inventors
- 1,577
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 6 | 0 |
| 1994 | 12 | 0 |
| 1995 | 6 | 0 |
| 1996 | 11 | 0 |
| 1997 | 6 | 0 |
| 1998 | 3 | 0 |
| 1999 | 9 | 0 |
| 2000 | 2 | 0 |
| 2001 | 3 | 2 |
| 2002 | 2 | 4 |
| 2003 | 3 | 5 |
| 2004 | 5 | 9 |
| 2005 | 5 | 15 |
| 2006 | 9 | 12 |
| 2007 | 3 | 11 |
| 2008 | 6 | 22 |
| 2009 | 7 | 19 |
| 2010 | 16 | 9 |
| 2011 | 8 | 14 |
| 2012 | 15 | 14 |
| 2013 | 15 | 23 |
| 2014 | 17 | 25 |
| 2015 | 26 | 38 |
| 2016 | 37 | 29 |
| 2017 | 37 | 35 |
| 2018 | 35 | 44 |
| 2019 | 47 | 47 |
| 2020 | 42 | 74 |
| 2021 | 46 | 45 |
| 2022 | 44 | 49 |
| 2023 | 38 | 65 |
| 2024 | 32 | 52 |
| 2025 | 46 | 71 |
| 2026 | 26 | 43 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Dam surrounding a die on a substrate22 Sep 2026US 12,745,668 B2Intel Corporation
- Packaging substrate, method of manufacturing an element package and method of manufacturing packaging substrate15 Sep 2026US 12,740,462 B2Absolics Inc.
- Electronic devices having embedded module and methods of manufacturing electronic devices having the same8 Sep 2026US 12,733,535 B2Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor package1 Sep 2026US 12,727,474 B2Samsung Electronics Co., Ltd.
- Chip package structure and method for producing the same1 Sep 2026US 12,727,506 B2Tong Hsing Electronic Industries, Ltd.
- Microelectronics device package integrating multiple dies1 Oct 2026US 2026/0305455 A1Texas Instruments Incorporated
- Ic sensor process utilizing gold wire-bonding24 Sep 2026US 2026/0293751 A1Microchip Technology Incorporated
- Method of forming a sealed cavity embedded in a semiconductor wafer17 Sep 2026US 2026/0282502 A1Analog Devices, Inc.
- Structure and method for embedding a plurality of devices and components into a substrate core27 Aug 2026US 2026/0256017 A1Advanced Micro Devices, Inc.
- Sensor package including a sensor die20 Aug 2026US 2026/0248028 A1Stmicroelectronics Pte Ltd
Most cited
By later US patents
- Method for fabricating an integrated circuit module849US 5,353,498 AGeneral Electric Company · 1994
- Multi-chip semiconductor arrangements using flip chip dies446US 5,399,898 ALSI Logic Corporation · 1995
- Embedded substrate for integrated circuit modules421US 5,497,033 AMartin Marietta Corporation · 1996
- Molded plastic semiconductor package including heat spreader268US 5,608,267 AOlin Corporation · 1997
- Integrated circuits protected by substrates with cavities, and methods of manufacture190US 10,446,456 B2Invensas Corporation · 2019