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US 2026/0248028 A1Published application
Sensor package including a sensor die
AssigneeStmicroelectronics Pte Ltd
InventorJing-En LUAN
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Abstract
The present disclosure is directed to embodiments of sensor package including a doped resin on respective surfaces and sidewalls of a transparent portion, a sensor die, and a support structure extending from the transparent portion to the sensor die. The support structure suspends the transparent portion over a sensor of the sensor die. The doped resin is doped with an additive material, and the additive material is activated by exposing the doped resin to a laser. The doped resin is exposed to the laser forming conductive layers extending along the doped resin for providing electrical connections within the sensor package and to electronic components external to the embodiments of the sensor die packages. The conductive layers are at least partially covered by a non-conductive layer.
Claims20
A method, comprising:
- coupling a transparent portion to a support structure on a first surface of a first die;
- forming a doped resin on a first sidewall of the die transverse to the first surface, on the first surface of the die, on a second sidewall of the support structure transverse to the first surface, on a third sidewall of the transparent portion transverse to the first surface;
- forming a first conductive layer extending along respective portions of the doped resin on the first sidewall and the first surface;
- and
- forming a non-conductive layer covering the first conductive layer and the doped resin.
2 more elements
A method, comprising:
- coupling a transparent portion to a support structure coupled to a sensor die, the support structure being spaced outward from a sensor of the sensor die, being spaced inward from a first conductive pad of the sensor die, and being spaced inward from a second conductive pad of the sensor die;
- forming a doped resin on a first surface of the sensor die, on a second surface of the sensor side opposite to the first surface of the sensor die, on a first sidewall of the sensor die that extends from the first surface to the second surface, on a second sidewall of the support, on a third sidewall of the transparent portion, and on a third surface of the transparent portion facing away from the sensor die;
- forming a first conductive layer on first portions of the doped resin extending along the first surface of the sensor die, the first sidewall of the sensor die, and the second surface of the sensor die, and the first conductive layer extending through the doped resin to the first conductive pad;
- forming a second conductive layer on the first conductive layer;
- forming a third conductive layer on second portions of the doped resin extending along the second sidewall of the support structure, the third sidewall of the transparent portion, and the third surface of the transparent portion;
- and
- forming a fourth conductive layer on the third conductive layer.
4 more elements
A method, comprising:
- coupling a sensor die to a first adhesive on a first support;
- coupling a support structure to the sensor die;
- coupling a transparent portion to the support structure;
- forming a doped resin on a first surface of the sensor die, on a first sidewall of the sensor die that extends from the first surface, on a second sidewall of the support, on a third sidewall of the transparent portion, and on a second surface of the transparent portion facing away from the sensor die;
- forming a first conductive layer on first portions of the doped resin extending along the first sidewall of the sensor die and the first surface of the sensor die, and the first conductive layer extending through the doped resin to a first conductive pad of the sensor die;
- forming a second conductive layer on the first conductive layer;
- forming a third conductive layer on second portions of the doped resin extending along the second sidewall of the support structure, the third sidewall of the transparent portion, and the second surface of the transparent portion;
- forming a fourth conductive layer on the third conductive layer;
- forming a molding compound on the doped resin, on the second conductive layer, and on the fourth conductive layer;
- removing the sensor die, the support structure, the transparent portion, the doped resin, the first conductive layer, the second conductive layer, the third conductive layer, the fourth conductive layer, and the molding compound from the first adhesive;
- flipping the sensor die, the support structure, the transparent portion, the doped resin, the first conductive layer, the second conductive layer, the third conductive layer, the fourth conductive layer, and the molding compound from the adhesive;
- coupling the fourth conductive layer to a second adhesive on a second support;
- and
- grinding the sensor die, the doped resin, the first conductive layer and the second conductive layer.
11 more elements
Dependencies are inferred from the claim text.