Electronic devices having embedded module and methods of manufacturing electronic devices having the same

An electronic device, comprising:

• a first embedded module comprising:
• a first module substrate comprising a first conductive structure;
• a second module substrate comprising a second conductive structure;
• and
• a first module component interposed between the first module substrate and the second module substrate, the first module component comprising:
• a first component terminal coupled to the first conductive structure;
• and
• a second component terminal coupled to the second conductive structure;
• a first module encapsulant encapsulating the first module component;
• a first device substrate coupled to the first module substrate and comprising a first outward conductive layer;
• a second device substrate coupled to the first module component and comprising a second outward conductive layer;
• device terminals coupled to the first module component;
• and
• a device encapsulant structure encapsulating the first embedded module, the first device substrate, the second device substrate, and the device terminals;
• wherein:
• the device terminals, the first outward conductive layer, and the second outward conductive layer are exposed from the device encapsulant structure.

A method of manufacturing an electronic device, comprising:

• providing a first embedded module comprising:
• a first module substrate comprising a first conductive structure;
• a second module substrate comprising a second conductive structure;
• a first module component interposed between the first module substrate and the second module substrate, the first module component comprising:
• a first component terminal coupled to the first conductive structure;
• and
• a second component terminal coupled to the second conductive structure;
• and
• a first module encapsulant encapsulating the first module component;
• providing a first device substrate coupled to the first module substrate and comprising a first outward conductive layer;
• providing a second device substrate coupled to the first module component and comprising a second outward conductive layer;
• providing device terminals coupled to the first module component;
• and
• providing a device encapsulant structure encapsulating the first embedded module, the first device substrate, the second device substrate, and the device terminals;
• wherein:
• the device terminals, the first outward conductive layer, and the second outward conductive layer are exposed from the device encapsulant structure.