Chip package structure and method for producing the same

A method for producing a chip package structure, at least comprising:

• providing a substrate;
• providing a chip and placing the chip upside-down on the substrate;
• forming a plurality of bonding wires coupled with a plurality of conduct portions of the chip and a plurality of substrate pads of the substrate;
• providing at least one reflecting member on an upper surface of the substrate, and surrounding an outer periphery of the chip;
• forming a support body on an upper surface of the substrate, the support body covering the at least one reflecting member;
• disposing a glass adhesive on a top surface of the support body;
• providing a package cover adhered to the support body by the glass adhesive;
• performing a solidifying process in which a solidifying light beam is emitted to the reflecting member and the reflecting member is utilized to reflect the solidifying light beam to the glass adhesive to solidify the glass adhesive;
• and
• performing a packaging process in which a package body is formed to cover an edge surface of the package cover and a top part of the support body.