H10W 74/127
Characterised by arrangements for sealing or adhesion
Official title: {characterised by arrangements for sealing or adhesion}
H10W74/127 (Characterised by arrangements for sealing or adhesion) appears on 2,182 US grants and 2,650 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,182
- Published applications
- 2,650
- Assignees
- 495
- Inventors
- 4,032
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 6 | 0 |
| 1993 | 4 | 0 |
| 1994 | 7 | 0 |
| 1995 | 5 | 0 |
| 1996 | 4 | 0 |
| 1997 | 8 | 0 |
| 1998 | 12 | 0 |
| 1999 | 8 | 0 |
| 2000 | 13 | 0 |
| 2001 | 18 | 5 |
| 2002 | 22 | 34 |
| 2003 | 25 | 44 |
| 2004 | 23 | 55 |
| 2005 | 34 | 64 |
| 2006 | 54 | 64 |
| 2007 | 42 | 78 |
| 2008 | 49 | 83 |
| 2009 | 48 | 65 |
| 2010 | 64 | 68 |
| 2011 | 62 | 63 |
| 2012 | 54 | 72 |
| 2013 | 72 | 72 |
| 2014 | 74 | 119 |
| 2015 | 116 | 132 |
| 2016 | 136 | 180 |
| 2017 | 161 | 175 |
| 2018 | 142 | 142 |
| 2019 | 145 | 147 |
| 2020 | 124 | 154 |
| 2021 | 106 | 139 |
| 2022 | 114 | 166 |
| 2023 | 114 | 178 |
| 2024 | 112 | 162 |
| 2025 | 116 | 131 |
| 2026 | 75 | 58 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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Most cited
By later US patents
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
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- Saw-singulated leadless plastic chip carrier427US 6,229,200 B1ASAT Ltd. · 2001
- Plastic integrated circuit device package and leadframe having partially undercut leads and die pad364US 6,281,568 B1Amkor Technology, Inc. · 2001
- Saw-singulated leadless plastic chip carrier339US 6,242,281 B1ASAT Ltd. · 2001